L6205N STMicroelectronics, L6205N Datasheet - Page 16

• Manufacturer Part Number: L6205N
• Description: IC DRVR FULL BRDG DUAL 20PWRDIP
• Manufacturer: STMicroelectronics
• Type: H Bridger

Specifications of L6205N

• Input Type: Non-Inverting
• Number Of Outputs: 4
• On-state Resistance: 300 mOhm
• Current - Output / Channel: 2.8A
• Current - Peak Output: 5.6A
• Voltage - Supply: 8 V ~ 52 V
• Operating Temperature: -25°C ~ 125°C
• Mounting Type: Through Hole
• Package / Case: 20-DIP (0.300", 7.62mm)
• Operating Supply Voltage: 8 V to 52 V
• Supply Current: 0.01 A
• Mounting Style: Through Hole
• Current, Output, High Level: 5.6 A
• Number Of Drivers: 2
• Package Type: PowerDIP20
• Temperature, Operating, Maximum: 150 °C
• Temperature, Operating, Minimum: -40 °C
• Voltage, Input, High Level: 7 V
• Voltage, Input, Low Level: -0.3 V
• Voltage, Supply: 52 V (Max.)
• For Use With: 497-5487 - EVAL BOARD FOR L6206N DIP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-4209-5

L6205
Figure 17. Mounting the PowerSO package.
Figure 18. PowerSO20 Junction-Ambient thermal resistance versus on-board copper area.
Figure 19. PowerDIP20 Junction-Ambient thermal resistance versus on-board copper area.
Figure 20. SO20 Junction-Ambient thermal resistance versus on-board copper area.
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º C / W
ºC / W
ºC / W
42
41
40
39
38
37
36
35
34
33
43
38
33
28
23
18
13
68
66
64
62
60
58
56
54
52
50
48
1
1
1
2
2
2
3
3
3
4
dissipating area
4
4
Slug soldered
to PCB with
5
5
5
6
s q . c m
s q. cm
s q . cm
6
6
Copper Area is on Bottom Side
Copper Area is on Top Side
7
W ith o ut G ro u nd La yer
W ith Gro un d La yer
W ith Gro un d La yer+ 16 via
H o le s
C o pp er A re a is o n T op S id e
7
7
8
8
8
9
9
9
10
10
10
1 1
plus ground layer
dissipating area
Slug soldered
to PCB with
11
11
1 2
12
12
13
dissipating area plus ground layer
contacted through via holes
Slug soldered to PCB with
On-Board Copper Area
On-Board Copper Area
On-Board Copper Area