BUK1M200-50SDLD,51 NXP Semiconductors, BUK1M200-50SDLD,51 Datasheet - Page 5
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BUK1M200-50SDLD,51
Manufacturer Part Number
BUK1M200-50SDLD,51
Description
MOSFET N-CH 50V 20SOIC
Manufacturer
NXP Semiconductors
Series
TOPFET™r
Type
Low Sider
Datasheet
1.BUK1M200-50SDLD51.pdf
(14 pages)
Specifications of BUK1M200-50SDLD,51
Input Type
Non-Inverting
Number Of Outputs
4
On-state Resistance
150 mOhm
Current - Output / Channel
2.7A
Current - Peak Output
6.1A
Operating Temperature
-40°C ~ 150°C
Mounting Type
Surface Mount
Package / Case
20-SOIC (7.5mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Supply
-
Philips Semiconductors
5. Thermal characteristics
Table 4:
9397 750 10956
Product data
Symbol
R
Fig 4. Normalized total power dissipation as a function of solder point temperature.
th(j-sp)
P
der
=
Parameter
thermal resistance from junction to
solder point.
Thermal characteristics
---------------------- -
P
tot 25 C
P
tot
100%
P der
(%)
120
80
40
0
0
Conditions
mounted on thermo clad board
one device active
all devices active
Rev. 01 — 02 April 2003
50
100
150
T sp ( C)
BUK1M200-50SDLD
03aa17
200
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
Min
-
-
Quad channel TOPFET™
Typ
-
-
Max
45
13.3
Unit
K/W
K/W
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