VND830MSP STMicroelectronics, VND830MSP Datasheet - Page 20

• Manufacturer Part Number: VND830MSP
• Description: IC DRVR HISIDE 2CH POWERSO10
• Manufacturer: STMicroelectronics
• Type: High Sider

Specifications of VND830MSP

• Input Type: Non-Inverting
• Number Of Outputs: 2
• On-state Resistance: 60 mOhm
• Current - Peak Output: 9A
• Voltage - Supply: 5.5 V ~ 36 V
• Operating Temperature: -40°C ~ 150°C
• Mounting Type: Surface Mount
• Package / Case: PowerSO-10 Exposed Bottom Pad
• Supply Voltage (min): 5.5 V
• Supply Current: 40 mA
• Maximum Power Dissipation: 73500 mW
• Maximum Operating Temperature: + 150 C
• Mounting Style: SMD/SMT
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Current - Output / Channel: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

Package and PCB thermal data
4
4.1
20/27
Package and PCB thermal data
PowerSO-10 thermal data
Figure 27. PowerSO-10 PC board
Figure 28. R
Note:
Layout condition of R
35 µm, Copper areas: from minimum pad lay-out to 8 cm
55
50
45
40
35
30
RTHj_amb (°C/W)
0
thj-amb
th
and Z
vs PCB copper area in open box free air condition
th
measurements (PCB FR4 area = 58 mm x 58 mm, PCB thickness = 2 mm, Cu thickness =
2
Doc ID 7379 Rev 4
PCB Cu heatsink area (cm^2)
4
2
).
6
Tj-Tamb=50°C
8
VND830MSP
10