VND830LSP-E STMicroelectronics, VND830LSP-E Datasheet
VND830LSP-E
Specifications of VND830LSP-E
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VND830LSP-E Summary of contents
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... V OUT CC (1) ( Description The VND830LSP monolithic device made using STMicroelectronics™ VIPower™ M0-3 technology intended for driving any kind of load with one side connected to ground. Active V pin voltage clamp protects the device against CC low energy spikes (see ISO7637 transient compatibility table). ...
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... PowerSO-10 thermal data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20 5 Package and packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.1 ECOPACK 5.2 PowerSO-10 mechanical data . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 5.3 PowerSO-10 packing information . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 25 6 Revision history . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 26 2/27 Solution 1: resistor in the ground line (RGND only Solution 2: diode (DGND) in the ground line . . . . . . . . . . . . . . . . . . . . . 17 ® packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Doc ID 10882 Rev 3 VND830LSP-E ...
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... VND830LSP-E List of tables Table 1. Device summary . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1 Table 2. Suggested connections for unused and not connected pins . . . . . . . . . . . . . . . . . . . . . . . . 5 Table 3. Absolute maximum ratings . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6 Table 4. Thermal data Table 5. Power output Table 6. Protection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 Table output diode Table 8. Status pin . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 9. Switching ( Table 10. Open-load detection . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 11. Logic input . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 Table 12 ...
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... PowerSO-10 thermal impedance junction ambient single pulse Figure 30. Thermal fitting model of a double channel HSD in PowerSO- Figure 31. PowerSO-10 package dimensions . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 23 Figure 32. PowerSO-10 suggested pad layout and tube shipment (no suffix Figure 33. Tape and reel shipment (suffix “TR” 4/ case . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . Doc ID 10882 Rev 3 VND830LSP-E ...
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... VND830LSP-E 1 Block diagram and pin description Figure 1. Block diagram GND INPUT1 STATUS1 OVERTEMP. 1 INPUT2 STATUS2 OVERTEMP. 2 Figure 2. Configuration diagram (top view) Table 2. Suggested connections for unused and not connected pins Connection / pin Floating To ground V cc OVERVOLTAGE CLAMP UNDERVOLTAGE CLAMP 1 DRIVER 1 CURRENT LIMITER 1 ...
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... I STAT1 STATUS 1 STAT1 I IN2 OUTPUT2 INPUT2 V IN2 I STAT2 STATUS 2 V GND STAT2 I GND during reverse battery condition. Table 3 Parameter C = 100 pF °C c Doc ID 10882 Rev 3 VND830LSP ( OUT1 V OUT1 I OUT2 V OUT2 may cause permanent damage to the Value 41 -0.3 -200 Internally limited -6 +/- 10 +/- 10 4000 ...
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... VND830LSP-E Table 3. Absolute maximum ratings (continued) Symbol Maximum switching energy 0.14 mH; R MAX T jstart T Junction operating temperature j T Case operating temperature c T Storage temperature STG 2.2 Thermal data Table 4. Thermal data Symbol R Thermal resistance junction-case thj-case R Thermal resistance junction-ambient thj-amb 1. When mounted on a standard single sided FR-4 board with 0.5 cm mounting and no artificial air flow ...
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... OUT OUT T = 125 ° OUT °C j (1) Parameter Test conditions 5.5 V < OUT - output diode Test conditions = 1 150 °C OUT j Doc ID 10882 Rev 3 VND830LSP-E < -40 °C < T < 150 °C, unless j Min. Typ. 5 ° 3 Min. Typ. 150 175 135 < -41 V ...
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... VND830LSP-E Table 8. Status pin Symbol Parameter V Status low output voltage I STAT I Status leakage current LSTAT Status pin input C STAT capacitance V Status clamp voltage SCL Table 9. Switching (V Symbol t Turn-on delay time d(on) t Turn-on delay time d(off) (dV /dt) Turn-on voltage slope OUT on (dV ...
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... Current limitation Overtemperature Undervoltage Overvoltage Output voltage > V Output current < Figure 5. Switching time waveforms 10/27 I < > V OUT OL OUT OL t DOL(on) Input Doc ID 10882 Rev 3 VND830LSP-E OVER TEMP STATUS TIMING T > TSD V INn V STATn t t SDL SDL Output Sense < TSD (T > TSD ...
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... VND830LSP-E Table 13. Electrical transient requirements on V ISO T/R 7637/1 test pulse Table 14. Electrical transient requirements on V ISO T/R 7637/1 Test pulse Table 15. Electrical transient requirements on V Class -25 V -50 V +25 V +50 V -25 V -50 V + +26.5 V +46.5 V Test levels results All functions of the device are performed as designed after exposure to disturbance ...
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... STATUS n INPUT n OUTPUT VOLTAGE STATUS n INPUT n OUTPUT VOLTAGE STATUS INPUT n OUTPUT CURRENT STATUS n 12/27 NORMAL OPERATION n UNDERVOLTAGE V USDhyst V USD n undefined OVERVOLTAGE V <V V > OPEN LOAD with external pull- OPEN LOAD without external pull-up n OVERTEMPERATURE T TSD Doc ID 10882 Rev 3 VND830LSP-E OV > V OUT OL ...
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... VND830LSP-E 2.4 Electrical characteristics curves Figure 7. Off-state output current IL(off1) 1.35 1.2 Off State 1.05 Vcc=13V Vin=Vout=0V 0.9 0.75 0.6 0.45 0.3 0.15 0 -50 - (ºC) Figure 9. Input clamp voltage Vicl (V) 8 7.75 Iin=1mA 7.5 7.25 7 6.75 6.5 6.25 6 -50 - (ºC) Figure 11. Status low output current Vstat (V) 0 ...
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... Figure 18. Input low level Vil (V) 2.25 2.125 2 1.875 1.75 1.625 1.5 1.375 1.25 100 125 150 175 Doc ID 10882 Rev 3 VND830LSP-E Iout=2A Tc=150ºC Tc=25ºC Tc= -40º Vcc (V) threshold Vin=0V - 100 125 Tc (ºC) -50 -25 ...
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... VND830LSP-E Figure 19. Input hysteresis voltage Vihyst (V) 1.4 1.3 1.2 1.1 1 0.9 0.8 0.7 0.6 0.5 -50 - (ºC) Figure 21. Turn-on voltage slope dVout/dt(on) (V/ms) 800 700 Vcc=13V Rl=6.5Ohm 600 500 400 300 200 100 0 -50 - (ºC) Figure 23 LIM case Ilim (A) 35 32.5 Vcc=13V 30 27 ...
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... STATUS2 prot INPUT2 V GND S(on)max ) / (-I ) GND (when V < 0: during reverse battery situations) is: GND the input thresholds and the status output S(on)max GND Doc ID 10882 Rev 3 VND830LSP OUTPUT1 OUTPUT2 GND R GND D GND only) GND resistor. GND becomes the sum of the S(on)max D ld ...
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... VND830LSP-E values. This shift varies depending on how many devices are ON in the case of several high-side drivers sharing the same R If the calculated power dissipation leads to a large resistor or several devices have to share the same resistor then ST suggests to utilize solution 2 (see 3.1.2 ...
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... OLmax L(off2) OUT , V and I OLmin OLmax L(off2) V batt DRIVER INPUT + LOGIC + R - STATUS V OL GROUND Doc ID 10882 Rev 3 VND830LSP-E ; this results in the following Olmin . ; this results in the following OLmax is pulled high (up to several mA), the pull- are available in Section 2.3: Electrical L(off2) OUT R L ...
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... VND830LSP-E 3.5 PowerSO-10 maximum demagnetization energy ( Figure 26. Maximum turn- off current versus load inductance (A) 100 10 A: Single pulse Repetitive pulse Repetitive pulse at T Condition 13 Values are generated with R In case of repetitive pulses, T the temperature specified above for curves B and C. 1 0,01 0,1 = 150 ° ...
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... Cu thickness = 35 µm, Copper areas: from minimum pad lay-out Figure 28. R thj-amb RTHj_amb (°C/ 20/27 (1) and Z measurements (PCB FR4 area = mm, PCB thickness = 2 mm PCB copper area in open box free air condition 2 4 PCB Cu heatsink area (cm^2) Doc ID 10882 Rev 3 VND830LSP Tj-Tamb=50° ...
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... VND830LSP-E Figure 29. PowerSO-10 thermal impedance junction ambient single pulse ZTH (°C/W) 1000 100 10 1 0.1 0.0001 0.001 Equation 1 pulse calculation formula : where p Figure 30. Thermal fitting model of a double channel HSD in PowerSO-10 Tj_1 Pd1 Tj_2 Pd2 0.01 0.1 Time ( – THtp C1 C2 ...
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... Package and PCB thermal data Table 16. Thermal parameter Area/island (cm 22/ (° (° (° (° (° (° (W.s/ °C) C2 (W.s /°C) C3 (W.s/ °C) C4 (W.s/ °C) C5 (W.s/ °C) C6 (W.s/ °C) Doc ID 10882 Rev 3 VND830LSP-E Footprint 6 0.15 0.8 0.7 0 0.0006 2.1E-03 0.013 0.3 0. ...
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... VND830LSP-E 5 Package and packing information ® 5.1 ECOPACK In order to meet environmental requirements, ST offers these devices in different grades of ® ECOPACK packages, depending on their level of environmental compliance. ECOPACK specifications, grade definitions and product status are available at: www.st.com. ® ECOPACK trademark. 5.2 PowerSO-10 mechanical data Figure 31 ...
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... Doc ID 10882 Rev 3 VND830LSP-E Max. 3.65 3.6 0.10 0.60 0.53 0.55 0.32 9.60 7.60 9.50 7.60 7.50 6.10 6.30 1.35 1.40 14.40 14.35 1 ...
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... VND830LSP-E 5.3 PowerSO-10 packing information Figure 32. PowerSO-10 suggested pad layout and tube shipment (no suffix) 14.6 - 14 Figure 33. Tape and reel shipment (suffix “TR”) TAPE DIMENSIONS According to Electronic Industries Association (EIA) Standard 481 rev. A, Feb. 1986 Tape width Tape Hole Spacing ...
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... Revision history 6 Revision history Table 18. Document revision history Date 1-Oct-2004 19-Jul-2010 25-Feb-2011 26/27 Revision 1 Initial release. Changed Features list. 2 Reformatted entire document. No content change. Updated I value in OUT 3 Updated Table 16: Thermal Doc ID 10882 Rev 3 VND830LSP-E Changes Features list. parameter. ...
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... VND830LSP-E Information in this document is provided solely in connection with ST products. STMicroelectronics NV and its subsidiaries (“ST”) reserve the right to make changes, corrections, modifications or improvements, to this document, and the products and services described herein at any time, without notice. All ST products are sold pursuant to ST’s terms and conditions of sale. ...