BD6989FVM-TR Rohm Semiconductor, BD6989FVM-TR Datasheet - Page 3
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BD6989FVM-TR
Manufacturer Part Number
BD6989FVM-TR
Description
IC MOTOR DVR BRUSHLESS 8MSOP
Manufacturer
Rohm Semiconductor
Datasheet
1.BD6989FVM-TR.pdf
(4 pages)
Specifications of BD6989FVM-TR
Applications
Fan Motor Driver
Number Of Outputs
1
Current - Output
800mA
Voltage - Supply
2.9 V ~ 8 V
Operating Temperature
-40°C ~ 105°C
Mounting Type
Surface Mount
Package / Case
8-VSSOP, 8-MSOP (0.118", 3.00mm Width)
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Voltage - Load
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Part Number:
BD6989FVM-TR
Manufacturer:
ROHM/罗姆
Quantity:
20 000
〇CAUTIONS ON USE
10) Testing on application boards
11) GND wiring pattern
12) Capacitor between output and GND
13) IC terminal input
1) Absolute maximum ratings
2) Connecting the power supply connector backward
3) Power supply line
4) GND potential
5) Thermal design
6) Inter-pin shorts and mounting errors
7) Actions in strong electromagnetic field
8) ASO
9) Thermal shut down circuit
An excess in the absolute maximum rations, such as supply voltage, temperature range of operating conditions, etc., can break
down the devices, thus making impossible to identify breaking mode, such as a short circuit or an open circuit. If any over
rated values will expect to exceed the absolute maximum ratings, consider adding circuit protection devices, such as fuses.
Connecting of the power supply in reverse polarity can damage IC. Take precautions when connecting the power supply lines.
An external direction diode can be added.
Back electromotive force causes regenerated current to power supply line, therefore take a measure such as placing a
capacitor between power supply and GND for routing regenerated current. And fully ensure that the capacitor characteristics have
no problem before determine a capacitor value. (when applying electrolytic capacitors, capacitance characteristic values are
reduced at low temperatures)
The potential of GND pin must be minimum potential in all operating conditions. Also ensure that all terminals except GND terminal
do not fall below GND voltage including transient characteristics. However, it is possible that the motor output terminal may
deflect below GND because of influence by back electromotive force of motor. Malfunction may possibly occur depending on
use condition, environment, and property of individual motor. Please make fully confirmation that no problem is found on operation
of IC.
Use a thermal design that allows for a sufficient margin in light of the power dissipation(Pd) in actual operating conditions.
Use caution when positioning the IC for mounting on printed circuit boards. The IC may be damaged if there is any connection error
or if pins are shorted together.
Use caution when using the IC in the presence of a strong electromagnetic field as doing so may cause the IC to malfunction.
When using the IC, set the output transistor so that it does not exceed absolute maximum rations or ASO.
The IC incorporates a built-in thermal shutdown circuit (TSD circuit). Operation temperature is 175 ℃ (typ.) and has a hysteresis
width of 25 ℃ (typ.). When IC chip temperature rises and TSD circuit works, the output terminal becomes an open state. TSD circuit
is designed only to shut the IC off to prevent thermal runaway. It is not designed to protect the IC or guarantee its operation. Do
not continue to use the IC after operation this circuit or use the IC in an environment where the operation of this circuit is assumed.
When testing the IC on an application board, connecting a capacitor to a pin with low impedance subjects the IC to stress.
Always discharge capacitors after each process or step. Always turn the IC’s power supply off before connecting it to or removing
it from a jig or fixture during the inspection process. Ground the IC during assembly steps as an antistatic measure. Use
similar precaution when transporting or storing the IC.
When using both small signal and large current GND patterns, it is recommended to isolate the two ground patterns, placing a
single ground point at the ground potential of application so that the pattern wiring resistance and voltage variations caused by
large currents do not cause variations in the small signal ground voltage. Be careful not to change the GND wiring pattern of
any external components, either.
When a large capacitor is connected between output and GND, if Vcc is shorted with 0V or GND for some cause, it is possible
that the current charged in the capacitor may flow into the output resulting in destruction. Keep the capacitor between output
and GND below 100uF.
When Vcc voltage is not applied to IC, do not apply voltage to each input terminal. When voltage above Vcc or below GND is
applied to the input terminal, parasitic element is actuated due to the structure of IC. Operation of parasitic element causes
mutual interference between circuits, resulting in malfunction as well as destruction in the last. Do not use in a manner
where parasitic element is actuated.
REV. F
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