IR3084AMPBF International Rectifier, IR3084AMPBF Datasheet - Page 42

• Manufacturer Part Number: IR3084AMPBF
• Description: IC XPHASE CONTROL 28-MLPQ
• Manufacturer: International Rectifier
• Series: XPhase™r

Specifications of IR3084AMPBF

• Applications: Processor
• Current - Supply: 14mA
• Voltage - Supply: 9.5 V ~ 16 V
• Operating Temperature: 0°C ~ 100°C
• Mounting Type: Surface Mount
• Package / Case: 28-MLPQ
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant

METAL AND SOLDER RESIST
 The solder resist should be pulled away from the metal lead lands by a minimum of 0.06mm. The
 The minimum solder resist width is 0.13mm, therefore it is recommended that the solder resist is
 At the inside corner of the solder resist where the lead land groups meet, it is recommended to
 The land pad should be Solder Mask Defined (SMD), with a minimum overlap of the solder resist onto
 Ensure that the solder resist in−between the lead lands and the pad land is ≥ 0.15mm due to the high
 The single via in the land pad should be tented with solder resist 0.4mm diameter, or 0.1mm larger
 No PCB traces should be routed nor vias placed under any of the 4 corners of the IC package. Doing
solder resist mis−alignment is a maximum of 0.05mm and it is recommended that the lead lands are
all Non Solder Mask Defined (NSMD). Therefore pulling the S/R 0.06mm will always ensure NSMD
pads.
completely removed from between the lead lands forming a single opening for each “group” of lead
lands.
provide a fillet so a solder resist width of ≥ 0.17mm remains.
the copper of 0.06mm to accommodate solder resist mis−alignment. In 0.5mm pitch cases it is
allowable to have the solder resist opening for the land pad to be smaller than the part pad.
aspect ratio of the solder resist strip separating the lead lands from the pad land.
than the diameter of the via.
so can cause the IC to rise up from the PCB resulting in poor solder joints to the IC leads.
Page 42 of 45
IR3084A
3/3/2009