L5985TR STMicroelectronics, L5985TR Datasheet - Page 27

• Manufacturer Part Number: L5985TR
• Description: IC REG SW 2A STEP DOWN 8-VFQFPN
• Manufacturer: STMicroelectronics
• Type: Step-Down (Buck)r

Specifications of L5985TR

• Internal Switch(s): Yes
• Synchronous Rectifier: No
• Number Of Outputs: 1
• Voltage - Output: 0.6 ~ 18 V
• Current - Output: 2A
• Frequency - Switching: 250kHz ~ 1MHz
• Voltage - Input: 2.9 ~ 18 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-VFQFN, 8-VFQFPN
• Power - Output: 1.5W
• Output Voltage: 3 V
• Output Current: 2 A
• Input Voltage: 2.9 V to 18 V
• Switching Frequency: 220 KHz to 275 KHz
• Operating Temperature Range: - 40 C to + 150 C
• Mounting Style: SMD/SMT
• Duty Cycle (max): 100 %
• For Use With: 497-6387 - BOARD EVAL FOR L5985
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 497-6861-2; L5985TR

L5985
5.6
Figure 16. Switching losses
Layout considerations
The PC board layout of switching DC/DC regulator is very important to minimize the noise
injected in high impedance nodes and interferences generated by the high switching current
loops.
In a step-down converter the input loop (including the input capacitor, the power MOSFET
and the free wheeling diode) is the most critical one. This is due to the fact that the high
value pulsed current are flowing through it. In order to minimize the EMI, this loop has to be
as short as possible.
The feedback pin (FB) connection to external resistor divider is a high impedance node, so
the interferences can be minimized placing the routing of feedback node as far as possible
from the high current paths. To reduce the pick up noise the resistor divider has to be placed
very close to the device. To filter the high frequency noise, a small capacitor (100 nF) can be
added as close as possible to the input voltage pin of the device.
Thanks to the exposed pad of the device, the ground plane helps to reduce the thermal
resistance junction to ambient; so a large ground plane enhances the thermal performance
of the converter allowing high power conversion.
In
Figure 17
a layout example is shown.
Doc ID 13006 Rev 5
Application information
27/37