LTC3407EMSE Linear Technology, LTC3407EMSE Datasheet - Page 15

• Manufacturer Part Number: LTC3407EMSE
• Description: IC REG DC/DC DUAL 1.5MHZ 10-MSOP
• Manufacturer: Linear Technology
• Type: Step-Down (Buck)r

Specifications of LTC3407EMSE

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 2
• Voltage - Output: 0.6 ~ 5 V
• Current - Output: 1A
• Frequency - Switching: 1.5MHz
• Voltage - Input: 2.5 ~ 5.5 V
• Operating Temperature: -40°C ~ 85°C
• Mounting Type: Surface Mount
• Package / Case: 10-MSOP Exposed Pad, 10-HMSOP, 10-eMSOP
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• Power - Output: -

(.0120 ± .0015)
PACKAGE DESCRIPTION
0.305 ± 0.038
TYP
(.206)
5.23
MIN
NOTE:
1. DIMENSIONS IN MILLIMETER/(INCH)
2. DRAWING NOT TO SCALE
3. DIMENSION DOES NOT INCLUDE MOLD FLASH, PROTRUSIONS OR GATE BURRS.
4. DIMENSION DOES NOT INCLUDE INTERLEAD FLASH OR PROTRUSIONS.
5. LEAD COPLANARITY (BOTTOM OF LEADS AFTER FORMING) SHALL BE 0.102mm (.004") MAX
RECOMMENDED SOLDER PAD LAYOUT
MOLD FLASH, PROTRUSIONS OR GATE BURRS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
INTERLEAD FLASH OR PROTRUSIONS SHALL NOT EXCEED 0.152mm (.006") PER SIDE
3.55 ±0.05
2.794 ± 0.102
(.110 ± .004)
2.15 ±0.05
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-2).
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
CHECK THE LTC WEBSITE DATA SHEET FOR CURRENT STATUS OF VARIATION ASSIGNMENT
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
0.25 ± 0.05
1.65 ±0.05
(2 SIDES)
(.0197)
2.083 ± 0.102
(.082 ± .004)
0.50
BSC
2.38 ±0.05
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
(2 SIDES)
0.889 ± 0.127
(.035 ± .005)
(.126 – .136)
3.20 – 3.45
0.50
BSC
GAUGE PLANE
(.007)
0.18
0.70 ±0.05
10-Lead Plastic MSOP , Exposed Die Pad
PACKAGE
OUTLINE
(Reference LTC DWG # 05-08-1664 Rev C)
(Reference LTC DWG # 05-08-1699 Rev B)
10-Lead Plastic DFN (3mm × 3mm)
(.010)
0.254
(SEE NOTE 6)
TOP MARK
DETAIL “A”
DETAIL “A”
MSE Package
PIN 1
DD Package
0.200 REF
0° – 6° TYP
0.53 ± 0.152
(.021 ± .006)
SEATING
PLANE
(.118 ± .004)
3.00 ± 0.102
(.007 – .011)
(.193 ± .006)
0.17 – 0.27
4.90 ± 0.152
(NOTE 3)
TYP
(.043)
0.75 ±0.05
MAX
3.00 ±0.10
1.10
(4 SIDES)
(.0197)
0.50
10
BSC
1 2 3 4 5
0.00 – 0.05
9
8
7 6
1.65 ± 0.10
(2 SIDES)
(.118 ± .004)
3.00 ± 0.102
(.0196 ± .003)
0.497 ± 0.076
(.034)
(NOTE 4)
0.86
REF
0.1016 ± 0.0508
BOTTOM VIEW—EXPOSED PAD
(.004 ± .002)
REF
5
R = 0.125
6
2.38 ±0.10
(2 SIDES)
TYP
10
1
0.50 BSC
0.25 ± 0.05
EXPOSED PAD OPTION
NO MEASUREMENT PURPOSE
0.40 ± 0.10
LTC3407
THE LEADFRAME FEATURE.
BOTTOM VIEW OF
CORNER TAIL IS PART OF
FOR REFERENCE ONLY
10
(DD) DFN REV B 0309
1
DETAIL “B”
0.05 REF
MSOP (MSE) 0908 REV C
DETAIL “B”
15
(.081 ± .004)
2.06 ± 0.102
(.072 ± .004)
1.83 ± 0.102
0.29
REF
3407fa