LTC3631IMS8E#TRPBF Linear Technology, LTC3631IMS8E#TRPBF Datasheet - Page 19

• Manufacturer Part Number: LTC3631IMS8E#TRPBF
• Description: IC CONV STP-DWN SYNC ADJ 8-MSOP
• Manufacturer: Linear Technology
• Type: Step-Down (Buck)r

Specifications of LTC3631IMS8E#TRPBF

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 1
• Voltage - Output: 0.8 ~ 45 V
• Current - Output: 100mA
• Voltage - Input: 4.5 ~ 45 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 8-MSOP Exposed Pad, 8-HMSOP, 8-eMSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -
• Frequency - Switching: -

package DescripTion
3.5 ±0.05
2.10 ±0.05
APPLY SOLDER MASK TO AREAS THAT ARE NOT SOLDERED
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
TOP MARK
1.65 ±0.05
(2 SIDES)
(NOTE 6)
0.25 ± 0.05
PIN 1
0.200 REF
NOTE:
1. DRAWING TO BE MADE A JEDEC PACKAGE OUTLINE M0-229 VARIATION OF (WEED-1)
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
ON TOP AND BOTTOM OF PACKAGE
2.38 ±0.05
(Reference LTC DWG # 05-08-1698 Rev C)
8-Lead Plastic DFN (3mm × 3mm)
0.50
BSC
DD Package
3.00 ±0.10
0.75 ±0.05
0.70 ±0.05
(4 SIDES)
PACKAGE
OUTLINE
0.00 – 0.05
1.65 ± 0.10
(2 SIDES)
BOTTOM VIEW—EXPOSED PAD
0.25 ± 0.05
R = 0.125
TYP
4
5
2.38 ±0.10
8
1
0.50 BSC
0.40 ± 0.10
(DD8) DFN 0509 REV C
LTC3631
19
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