LTC3417AIFE-1#PBF Linear Technology, LTC3417AIFE-1#PBF Datasheet - Page 19

• Manufacturer Part Number: LTC3417AIFE-1#PBF
• Description: IC BUCK SYNC ADJ 1A/1.5A 20TSSOP
• Manufacturer: Linear Technology
• Type: Step-Down (Buck)r

Specifications of LTC3417AIFE-1#PBF

• Internal Switch(s): Yes
• Synchronous Rectifier: Yes
• Number Of Outputs: 2
• Voltage - Output: 0.8 ~ 5 V
• Current - Output: 1A, 1.5A
• Frequency - Switching: 1.5MHz, 0.6MHz ~ 4MHz
• Voltage - Input: 2.25 ~ 5.5 V
• Operating Temperature: -40°C ~ 125°C
• Mounting Type: Surface Mount
• Package / Case: 20-TSSOP Exposed Pad, 20-eTSSOP, 20-HTSSOP
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Power - Output: -

PACKAGE DESCRIPTION
3.50 ± 0.05
2.20 ± 0.05
1.65 ± 0.05
(2 SIDES)
RECOMMENDED SOLDER PAD PITCH AND DIMENSIONS
6.60 ± 0.10
(.0035 – .0079)
0.09 – 0.20
4.40 ± 0.05
(2 SIDES)
NOTE:
1. CONTROLLING DIMENSION: MILLIMETERS
2. DIMENSIONS ARE IN
3. DRAWING NOT TO SCALE
4.50 ± 0.10
Information furnished by Linear Technology Corporation is believed to be accurate and reliable.
However, no responsibility is assumed for its use. Linear Technology Corporation makes no representa-
tion that the interconnection of its circuits as described herein will not infringe on existing patent rights.
RECOMMENDED SOLDER PAD LAYOUT
0.50 BSC
0.25 ± 0.05
(.169 – .177)
4.30 – 4.50*
(.020 – .030)
0.50 – 0.75
SEE NOTE 4
(.195)
MILLIMETERS
4.95
(SEE NOTE 6)
(INCHES)
0.65 ± 0.05
TOP MARK
0.65 BSC
16-Lead Plastic DFN (5mm × 3mm)
PACKAGE
OUTLINE
20-Lead Plastic TSSOP (4.4mm)
(Reference LTC DWG # 05-08-1663)
(Reference LTC DWG # 05-08-1706)
PIN 1
0.200 REF
Exposed Pad Variation CA
0.45 ± 0.05
NOTE:
1. DRAWING PROPOSED TO BE MADE VARIATION OF VERSION (WJED-1) IN JEDEC
2. DRAWING NOT TO SCALE
3. ALL DIMENSIONS ARE IN MILLIMETERS
4. DIMENSIONS OF EXPOSED PAD ON BOTTOM OF PACKAGE DO NOT INCLUDE
5. EXPOSED PAD SHALL BE SOLDER PLATED
6. SHADED AREA IS ONLY A REFERENCE FOR PIN 1 LOCATION ON THE
(.108)
0.25
REF
2.74
1.05 ± 0.10
PACKAGE OUTLINE MO-229
MOLD FLASH. MOLD FLASH, IF PRESENT, SHALL NOT EXCEED 0.15mm ON ANY SIDE
TOP AND BOTTOM OF PACKAGE
0° – 8°
DHC Package
4. RECOMMENDED MINIMUM PCB METAL SIZE
*DIMENSIONS DO NOT INCLUDE MOLD FLASH. MOLD FLASH
FE Package
SHALL NOT EXCEED 0.150mm (.006") PER SIDE
FOR EXPOSED PAD ATTACHMENT
5.00 ± 0.10
(2 SIDES)
(.0256)
0.65
BSC
20 1918 17 16 15
1
(.0077 – .0118)
0.195 – 0.30
2
TYP
3 4 5 6 7 8 9 10
(.252 – .260)
6.40 – 6.60*
3.00 ± 0.10
0.75 ± 0.05
(2 SIDES)
(.195)
4.95
14 13
0.00 – 0.05
12
1.65 ± 0.10
(2 SIDES)
R = 0.20
11
FE20 (CA) TSSOP 0204
TYP
(.002 – .006)
0.05 – 0.15
(.108)
(.047)
2.74
MAX
1.20
(.252)
6.40
9
8
BSC
BOTTOM VIEW—EXPOSED PAD
LTC3417A-1
4.40 ± 0.10
(2 SIDES)
R = 0.115
TYP
0.50 BSC
0.25 ± 0.05
16
1
0.40 ± 0.10
19
(DHC16) DFN 1103
PIN 1
NOTCH
3417a1fa