HCPL-2533#300 Avago Technologies US Inc., HCPL-2533#300 Datasheet - Page 3

OPTOCOUPLER 8-SMD GW

HCPL-2533#300

Manufacturer Part Number
HCPL-2533#300
Description
OPTOCOUPLER 8-SMD GW
Manufacturer
Avago Technologies US Inc.
Datasheet

Specifications of HCPL-2533#300

Input Type
DC
Package / Case
8-SMD Gull Wing
Voltage - Isolation
3750Vrms
Number Of Channels
2, Unidirectional
Current - Output / Channel
8mA
Data Rate
250kbps
Propagation Delay High - Low @ If
800ns @ 8mA
Current - Dc Forward (if)
25mA
Output Type
Open Collector
Mounting Type
Surface Mount, Gull Wing
Isolation Voltage
3750 Vrms
Output Device
Phototransistor
Configuration
2 Channel
Current Transfer Ratio
22 %
Maximum Baud Rate
1 MBps
Maximum Forward Diode Voltage
1.7 V
Maximum Reverse Diode Voltage
5 V
Maximum Input Diode Current
25 mA
Maximum Power Dissipation
45 mW
Maximum Operating Temperature
+ 70 C
Minimum Operating Temperature
0 C
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HCPL-2533#300HCPL-2533
Manufacturer:
AVAGO
Quantity:
1 000
Company:
Part Number:
HCPL-2533#300HCPL-2533-000E
Manufacturer:
AVAGO
Quantity:
5 000
Company:
Part Number:
HCPL-2533#300HCPL-2533-300E
Manufacturer:
AVAGO
Quantity:
5 000
Company:
Part Number:
HCPL-2533#300HCPL-2533-500E
Manufacturer:
AVAGO
Quantity:
5 000
Solder Reflow Thermal Profile
Recommended Pb-Free IR Profile
Regulatory Information
The devices contained in this data sheet have been approved by the following organizations:
UL
Recognized under UL 1577, Component Recognition
Program, File E55361.
CSA
Approved under CSA Component Acceptance Notice
#5, File CA 88324.
3
TEMPERATURE
ROOM
NOTES:
THE TIME FROM 25
T
Note: Non-halide flux should be used.
T
T
smax
smax
smin
300
200
100
T
T
25
p
L
0
= 200
Note: Non-halide flux should be used.
0
150 - 200
217
PREHEATING RATE 3 ° C + 1 ° C/- 0.5 ° C/SEC.
REFLOW HEATING RATE 2.5 ° C ± 0.5 ° C/SEC.
160 ° C
150 ° C
140 ° C
°
°
C, T
C
t 25
3
°
60 to 180 SEC.
smin
C
°
PREHEAT
C/SEC. MAX.
°
°
C to PEAK TEMPERATURE = 8 MINUTES MAX.
C to PEAK
RAMP-UP
= 150
t
s
50
260 +0/-5
3 ° C + 1 ° C/- 0.5 ° C
°
C
PREHEATING TIME
150 ° C, 90 + 30 SEC.
TIME
°
C
2.5 ° C ± 0.5 ° C/SEC.
t
t
L
p
100
TIME (SECONDS)
TIME WITHIN 5
PEAK TEMPERATURE
20-40 SEC.
60 to 150 SEC.
RAMP-DOWN
6
°
TEMP.
PEAK
245 ° C
C/SEC. MAX.
150
°
C of ACTUAL
SEC.
SEC.
30
IEC/EN/DIN EN 60747-5-2
Approved under:
IEC 60747-5-2:1997 + A1:2002
EN 60747-5-2:2001 + A1:2002
DIN EN 60747-5-2 (VDE 0884 Teil 2):2003-01.
(Option 060 only)
30
50 SEC.
SOLDERING
200 ° C
TIME
200
PEAK
TEMP.
240 ° C
TIGHT
TYPICAL
LOOSE
TEMP.
PEAK
230 ° C
250

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