PC81711NIP0F Sharp Microelectronics, PC81711NIP0F Datasheet
PC81711NIP0F
Specifications of PC81711NIP0F
Related parts for PC81711NIP0F
PC81711NIP0F Summary of contents
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PC8171xNSZ0F Series ■ Description PC8171xNSZ0F Series contains an IRED optically coupled to a phototransistor packaged in a 4pin DIP, available in SMT gullw- ing lead-form option. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is 80V, CTR is 100% ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions 1. Through-Hole [ex. PC8171xNSZ0F] Rank mark Anode mark Factory identification mark Date code ±0.5 6.5 ±0.3 7.62 Epoxy resin θ θ θ : ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
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... Model Line-up Lead Form Through-Hole SMT Gullwing Sleeve Taping Package 100pcs/sleeve 2 000pcs/reel PC81710NSZ0F PC81710NIP0F PC81711NSZ0F PC81711NIP0F PC81712NSZ0F PC81712NIP0F Model No. PC81713NSZ0F PC81713NIP0F PC81715NSZ0F PC81715NIP0F PC81716NSZ0F PC81716NIP0F PC81718NSZ0F PC81718NIP0F Please contact a local SHARP sales representative to inquire about production status. I [mA] C Rank mark (I =0 ...
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Fig.1 Test Circuit for Common Mode Rejection Voltage Fig.2 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.4 Collector Power Dissipation vs. Ambient Temperature 250 200 ...
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Fig.6 Peak Forward Current vs. Duty Ratio 1 000 Pulse width≤100µ 100 10 −3 − Duty ratio Fig.8 Current Transfer Ratio vs. Forward Current 800 700 600 500 400 300 200 100 0 0.1 1 Forward ...
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Fig.12 Collector Dark Current vs. Ambient Temperature − =50V CE −6 10 −7 10 −8 10 −9 10 −10 10 −11 10 −30 −20 − Ambient temperature T Fig.14 Response Time vs. ...
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Design Considerations ● Design guide While operating at I <0.5mA, CTR variation may increase. F Please make design considering this fact. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...
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Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The ...
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Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.4 Reel structure and ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...