TLP124(BV-TPR,F) Toshiba, TLP124(BV-TPR,F) Datasheet - Page 42

PHOTOCOUPLER TRANS OUT 4-MSOP

TLP124(BV-TPR,F)

Manufacturer Part Number
TLP124(BV-TPR,F)
Description
PHOTOCOUPLER TRANS OUT 4-MSOP
Manufacturer
Toshiba
Datasheets

Specifications of TLP124(BV-TPR,F)

Number Of Channels
1
Input Type
DC
Voltage - Isolation
3750Vrms
Current Transfer Ratio (min)
200% @ 1mA
Current Transfer Ratio (max)
1200% @ 1mA
Voltage - Output
80V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
400mV
Output Type
Transistor
Mounting Type
Surface Mount
Package / Case
4-MSOP
Maximum Collector Emitter Voltage
80 V
Maximum Collector Emitter Saturation Voltage
0.4 V
Isolation Voltage
3750 Vrms
Current Transfer Ratio
1200 %
Maximum Forward Diode Voltage
1.3 V
Maximum Collector Current
10 mA
Maximum Power Dissipation
200 mW
Maximum Operating Temperature
+ 100 C
Minimum Operating Temperature
- 55 C
Maximum Fall Time
8 us
Maximum Input Diode Current
20 mA
Maximum Reverse Diode Voltage
5 V
Maximum Rise Time
8 us
Output Device
Transistor
Number Of Elements
1
Reverse Breakdown Voltage
5V
Forward Voltage
1.3V
Forward Current
50mA
Collector-emitter Voltage
80V
Package Type
MFSOP
Collector Current (dc) (max)
50mA
Power Dissipation
200mW
Collector-emitter Saturation Voltage
0.4V
Pin Count
4
Mounting
Surface Mount
Operating Temp Range
-25C to 75C
Operating Temperature Classification
Commercial
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Other names
TLP124BVFTR
6
The DIP4, DIP6, DIP8 and DIP16 packages offer three surface-mount lead form options and a wide-spaced lead form option. The
electrical characteristics are identical, regardless of these options.
Example 1: Standard part: TLP620(F)
1
Package Information
Lead Form Options for DIP Packages
Surface-mount option: TLP620(LF1,F): Packed in stick magazines (see page 49).
Surface-mount and tape-and-reel options: TLP620(TP1,F): Packed in tape-and-reel (see page 51).
■ Standard part names should be used when applying for safety standard approval.
■ The package dimensions and lead form options of the TLP781, TLP785 differ from those shown above.
Carrier Tape Code
Package Outlines
Lead Form Code
See the TLP781, TLP785 datasheet.
Appearance
Lead Form
6-pin DIP
4-pin DIP
6
1 2
Dimensions
All other package dimensions are the same as for each standard package
specification.
Dimension
4 3
1
5
2
(TP1)
(LF1)
4
3
A
B
C
Version
16
1
8
1
Min
6.4
16-pin DIP
8-pin DIP
(0.35 typ.)
(LF1)
42
Surface-Mount
Max
10.0
5
4
(TP4)
(LF4)
9
8
Min
8.0
(0.25 typ.)
B
(LF4)
Max
12.0
Min
6.4
* Tape-and-reel packing is not available with (LF2).
(LF5)
(TP5)
A
C
(LF5)
Unit: mm
Max
10.0
0.2
Not available*
Wide-Spaced
10 to 12
(LF2)
10.16

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