PC123Y1J000F Sharp Microelectronics, PC123Y1J000F Datasheet
PC123Y1J000F
Specifications of PC123Y1J000F
Related parts for PC123Y1J000F
PC123Y1J000F Summary of contents
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PC123J00000F Series ■ Description PC123J00000F Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin DIP, available in wide-lead spacing option and SMT gullwing lead-form option. Input-output isolation voltage(rms) is 5.0kV. CTR is 50% to ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions 1. Through-Hole [ex. PC123J00000F] Rank mark Anode mark Factory identification mark Date code 1 4 PC123 2 3 ±0.3 6.5 ±0.30 7.62 Epoxy resin ±0.10 0.26 θ θ θ ...
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SMT Gullwing Lead-Form [ex. PC123PJ0000F] Rank mark Factory identification mark Anode mark Date code ±0.3 6.5 ±0.30 7.62 Epoxy resin +0.4 +0.4 1.0 1.0 −0.0 −0.0 +0.0 10.0 −0.5 Product ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
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... Model Line-up Lead Form Through-Hole Package DIN EN60747-5-2 −−−−−− PC123J00000F PC123YJ0000F PC123AJ0000F PC123Y1J000F Model No. PC123BJ0000F PC123Y2J000F PC123CJ0000F PC123Y5J000F PC123SJ0000F PC123YSJ000F Lead Form SMT Gullwing Package DIN EN60747-5-2 −−−−−− PC123PJ0000F PC123PYJ000F ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 − Ambient temperature T ...
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Fig.7 Current Transfer Ratio vs. Forward Current 300 250 200 150 100 50 0 0.1 1 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 50 0 − Ambient temperature T Fig.11 ...
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Fig.13 Test Circuit for Response Time Input V CC Output Output R Input Please refer to the conditions in Fig.12. Fig.15 Collector-emitter Saturation Voltage vs. Forward Current 5.0 I =0.5mA C 1mA 4.5 ...
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Design Considerations ■ Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...
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Package specification ● Sleeve package 1. Through-Hole Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless ...
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Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.40 ...
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Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 24.0 11.5 H ±0.1 12.4 0.40 Reel structure and Dimensions e ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...