PC355NTJ000F Sharp Microelectronics, PC355NTJ000F Datasheet
PC355NTJ000F
Specifications of PC355NTJ000F
PC355NTJ000F
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PC355NTJ000F Summary of contents
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PC355NJ0000F Series ■ Description PC355NJ0000F Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin Mini-flat. Input-output isolation voltage(rms) is 3.75kV. CTR is MIN 600% at input current of 1.0mA. ■ Features 1. 4-pin Mini-flat ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions ±0.3 3.6 ±0.25 2. Date code SHARP mark "S" Anode mark 1 2 ±0.1 0.4 Epoxy resin Product mass : approx. 0.1g Plating material : SnCu ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
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... Model Line-up Taping Package 3 000 pcs/reel 750 pcs/reel Model No. PC355NJ0000F PC355NTJ000F Please contact a local SHARP sales representative to inquire about production status. PC355NJ0000F Series 5 Sheet No.: D2-A00802EN ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 200 150 100 50 0 − Ambient temperature T ...
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Fig.7 Current Transfer Ratio vs. Forward Current 5 000 4 000 3 000 2 000 1 000 0 0.1 1 Forward current I F Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150 100 50 0 − ...
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Fig.13 Test Circuit for Response Time V CC Input R L Input R Output Output Please refer to the conditions in Fig.12 Remarks : Please be aware that all data in the graph are just ...
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Design Considerations ■ Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3 minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, ...
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Package specification ● Tape and Reel package 1. 3 000pcs/reel Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 ...
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Package materials Carrier tape : A-PET (with anti-static material) Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A B ±0.3 ±0.1 12.0 5 ±0.1 ±0.05 7.4 ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...