PC3H712NIP Sharp Microelectronics, PC3H712NIP Datasheet
PC3H712NIP
Specifications of PC3H712NIP
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PC3H712NIP Summary of contents
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PC3H71xNIP Series ∗ 4-channel package type is also available. (model No. PC3Q71xNIP Series) ■ Description PC3H71xNIP Series contains a IRED optically coupled to a phototransistor packaged in a 4-pin mini-flat, half pitch type. Input-output isolation voltage(rms) is 2.5kV. ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions Rank mark Date code SHARP mark "S" Anode mark ±0.2 4.4 ±0.3 5.3 (1.7) +0.4 0.5 −0.2 +0.2 7.0 −0 Reference dimensions Anode 1 ...
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Data code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
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... Model Line-up Taping Package Rank mark 3 000pcs/reel PC3H710NIP with or without PC3H711NIP Model No. PC3H712NIP PC3H715NIP Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. I [mA] C =0.5mA, V =5V, T =25˚ 0.5 to 3.5 A 0.7 to 1.75 B 1.0 to 2.5 0.7 to 2.5 ...
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Fig.1 Test Circuit for Common Mode Rejection Voltage Fig.2 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.4 Collector Power Dissipation vs. Ambient Temperature 200 150 100 ...
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Fig.6 Peak Forward Current vs. Duty Ratio 2 000 Pulse width≤100µs =25˚ 000 500 200 100 −3 − Duty ratio Fig.8 Current Transfer Ratio vs. Forward Current ...
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Fig.12 Collector Dark Current vs. Ambient Temperature −5 10 =50V V CE −6 10 −7 10 −8 10 −9 10 −10 10 −11 10 −30 −20 − Ambient temperature T Fig.14 Response Time vs. ...
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Design Considerations ● Design guide While operating at I <0.5mA, CTR variation may increase. F Please make design considering this fact. In case that some sudden big noise caused by voltage variation is provided between primary and secondary terminals ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...
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Package specification ● Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 12.0 H ±0.1 7.5 Reel structure and ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...