PC123 Sharp Microelectronics, PC123 Datasheet - Page 11
![PHOTOCOUPLER TRAN OUT 4-DIP](/photos/7/69/76930/425-4-dip_sml.jpg)
PC123
Manufacturer Part Number
PC123
Description
PHOTOCOUPLER TRAN OUT 4-DIP
Manufacturer
Sharp Microelectronics
Datasheet
1.PC123ZY2.pdf
(16 pages)
Specifications of PC123
Number Of Channels
1
Input Type
DC
Voltage - Isolation
5000Vrms
Current Transfer Ratio (min)
50% @ 5mA
Current Transfer Ratio (max)
400% @ 5mA
Voltage - Output
70V
Current - Output / Channel
50mA
Current - Dc Forward (if)
50mA
Vce Saturation (max)
200mV
Output Type
Transistor
Mounting Type
Through Hole
Package / Case
4-DIP
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
425-1308-5
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
PC123
Manufacturer:
SHARP
Quantity:
10 740
Company:
Part Number:
PC123
Manufacturer:
SHARP
Quantity:
17 781
Part Number:
PC123
Manufacturer:
SHARP/夏普
Quantity:
20 000
Company:
Part Number:
PC123(FY8J00F)
Manufacturer:
OKI
Quantity:
380
Part Number:
PC123(FY8J00F)
Manufacturer:
SHARP
Quantity:
20 000
Part Number:
PC123(Y61)
Manufacturer:
SHARP
Quantity:
20 000
Company:
Part Number:
PC123-1
Manufacturer:
SHARP
Quantity:
18 220
Part Number:
PC123A
Manufacturer:
SHARP
Quantity:
20 000
■ Manufacturing Guidelines
● Soldering Method
Reflow Soldering:
Flow Soldering :
Hand soldering
Other notices
Reflow soldering should follow the temperature profile shown below.
Soldering should not exceed the curve of temperature profile and time.
Please don't solder more than twice.
Due to SHARP's double transfer mold construction submersion in flow solder bath is allowed under the below
listed guidelines.
Flow soldering should be completed below 270˚C and within 10s.
Preheating is within the bounds of 100 to 150˚C and 30 to 80s.
Please don't solder more than twice.
Hand soldering should be completed within 3s when the point of solder iron is below 400˚C.
Please don't solder more than twice.
Please test the soldering method in actual condition and make sure the soldering works fine, since the impact
on the junction between the device and PCB varies depending on the tooling and soldering conditions.
(˚C)
300
200
100
0
0
Terminal : 260˚C peak
( package surface : 250˚C peak)
1
Preheat
150 to 180˚C, 120s or less
2
11
3
Reflow
220˚C or more, 60s or less
4
(min)
Sheet No.: D2-A02902EN
PC123 Series