PC853XI Sharp Microelectronics, PC853XI Datasheet
PC853XI
Specifications of PC853XI
Related parts for PC853XI
PC853XI Summary of contents
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PC852X Series PC853X Series ■ Description PC852X Series/PC853X Series contains an IRED optically coupled to a phototransistor packaged in a 4-pin DIP, available in SMT gullw- ing lead-form option. Input-output isolation voltage(rms) is 5.0kV. Collector-emitter voltage is 350V ...
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Internal Connection Diagram 1 2 ■ Outline Dimensions ● PC852X Series 1. Through-Hole [ex. PC852X] Anode mark Factory identification mark Date code ±0.5 6.5 ±0.3 7.62 Epoxy resin ±0.1 0.26 ...
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... Anode mark Factory identification mark Date code ±0.5 6.5 ±0.3 7.62 Epoxy resin ±0.1 0.26 θ θ θ 13˚ 2. SMT Gullwing Lead-Form [ex. PC853XI] Anode mark 1 2 ±0.5 4.58 +0.4 1.0 −0 ±0.1 0.5 3 PC852X Series/PC853X Series (Unit : mm) Factory identification mark Date code ± ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol PC852X PC853X Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation ...
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... PC852X PC852XY ● PC853X Series Lead Form Through-Hole SMT Gullwing Sleeve Package 100pcs/sleeve VDE0884 - - Model No. PC853X PC853XI Please contact a local SHARP sales representative to inquire about production status and Lead-Free options. SMT Gullwing Taping 2 000pcs/reel - - Approved PC852XI PC852XP PC852XPY Taping 2 000pcs/reel - PC853XP ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3-a Collector Power Dissipation vs. Ambient Temperature 200 150 100 50 0 − Ambient temperature T Fig.4 ...
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Fig.6 Forward Current vs. Forward Voltage 500 T =75˚C a 200 50˚C 100 0.5 1.0 1.5 2.0 Forward voltage V Fig.7-b Current Transfer Ratio vs. Forward Current 5 000 V = ...
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Fig.10 Collector - emitter Saturation Voltage vs. Ambient Temperature 1.2 1.0 0.8 0.6 0.4 0.2 0 − Ambient temperature T Fig.12 Response Time vs. Load Resistance 1 000 V = =20mA 500 C T =25˚C ...
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Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...
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Package specification ● Sleeve package Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed by tabbed and tabless stoppers. The ...
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Tape and Reel package Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.4 Reel structure and ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...