AFCT-5961NLZ Avago Technologies US Inc., AFCT-5961NLZ Datasheet - Page 4
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AFCT-5961NLZ
Manufacturer Part Number
AFCT-5961NLZ
Description
TXRX OPT SM SONET OC3/SDH 2X5
Manufacturer
Avago Technologies US Inc.
Series
METRAKr
Datasheet
1.AFCT-5961TGZ.pdf
(16 pages)
Specifications of AFCT-5961NLZ
Applications
General Purpose
Data Rate
155Mbps
Wavelength
1300nm
Voltage - Supply
3.1 V ~ 3.5 V
Connector Type
LC Duplex
Mounting Type
Through Hole
Data Rate Max
0.155Gbps
Supply Voltage
3.3V
Wavelength Typ
1300nm
Leaded Process Compatible
Yes
Optical Fiber Type
TX/RX
Data Transfer Rate
155Mbps
Optical Rise Time
2/2.2ns
Optical Fall Time
2/2.2ns
Operating Temperature Classification
Commercial
Peak Wavelength
1360nm
Package Type
DIP With Connector
Operating Supply Voltage (min)
3.1V
Operating Supply Voltage (typ)
3.3V
Operating Supply Voltage (max)
3.5V
Output Current
50mA
Operating Temp Range
-5C to 70C
Mounting
Snap Fit To Panel
Pin Count
10
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Package
The overall package concept for these devices consists
of the following basic elements; two optical subassem-
blies, a electrical subassembly and the housing as illus-
trated in the block diagram in Figure 3.
The package outline drawing and pin out are shown in
Figures 4 and 5. The details of this package outline and
pin out are compliant with the multisource definition of
the 2 x 5 DIP. The low profile of the Avago Technologies
transceiver design complies with the maximum height
allowed for the LC connector over the entire length of
the package.
The electrical subassembly consists of high volume
multilayer printed circuit board on which the IC and
various surface-mounted passive circuit elements are
attached.
NOTE: NOSE CLIP PROVIDES CONNECTION TO CHASSIS GROUND FOR BOTH EMI AND THERMAL DISSIPATION.
Figure 3. Block Diagram
DATA OUT
DATA OUT
SIGNAL
DATA IN
DATA IN
Tx DISABLE
4
DETECT
AND CONTROL
LASER DRIVER
T
X
CIRCUIT
QUANTIZER IC
GROUND
R
T
X
X
SUPPLY
SUPPLY
R
X
MONITORING
LASER DIODE
MODULATOR
LASER BIAS
GROUND
CASE
The optical subassemblies are attached to the electrical
subassembly. These two units are then fitted within the
outer housing of the transceiver. The housing is then
encased with a metal EMI protective shield.
The electrical subassemby carries the signal pins that
exit from the bottom of the transceiver. The solder
posts are designed to provide the mechanical strength
required to withstand the loads imposed on the trans-
ceiver by mating with the LC connectored fiber cables.
Although they are not connected electrically to the
transceiver, it is recommended to connect them to
chassis ground.
PIN PHOTODIODE
PREAMPLIFIER
SUBASSEMBLY
LASER
OPTICAL
SUBASSEMBLY
NOTE
LC
RECEPTACLE