HSMC-A101-S00J1 Avago Technologies US Inc., HSMC-A101-S00J1 Datasheet - Page 8
![LED 635NM RED 2-PLCC SMD](/photos/8/6/80697/hsmc-a101-s00j1_sml.jpg)
HSMC-A101-S00J1
Manufacturer Part Number
HSMC-A101-S00J1
Description
LED 635NM RED 2-PLCC SMD
Manufacturer
Avago Technologies US Inc.
Type
Uni-Colorr
Datasheet
1.HSMS-A100-J00J1.pdf
(12 pages)
Specifications of HSMC-A101-S00J1
Package / Case
2-PLCC
Viewing Angle
120°
Color
Red
Luminous Flux @ Current - Test
690 mlm
Millicandela Rating
220mcd
Current - Test
20mA
Wavelength - Dominant
626nm
Wavelength - Peak
635nm
Voltage - Forward (vf) Typ
2.4V
Lens Type
Clear
Lens Style/size
Round with Flat Top
Size / Dimension
3.20mm L x 2.80mm W
Height
1.90mm
Mounting Type
Surface Mount
Resistance Tolerance
626nm
Led Size
3.2 mm x 2.8 mm
Illumination Color
Red
Operating Voltage
1.9 V
Wavelength
626 nm
Luminous Intensity
220 mcd
Mounting Style
SMD/SMT
Package Type
PLCC
Emitting Color
Red
Test Current (it)
20mA
Forward Current
30mA
Dominant Wave Length
626nm
Forward Voltage
2.4V
Product Length (mm)
3.2mm
Product Height (mm)
1.8mm
Product Depth (mm)
2.8mm
Mounting
Surface Mount
Peak Wavelength
635nm
Shape Type
Circular
Chip Material
AlGaInP
Main Category
Chip LED
Number Of Elements
1
Pin Count
2
Operating Temperature Classification
Industrial
Operating Temp Range
-55C to 100C
Reverse Voltage
5V
Power Dissipation
63mW
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Lead free / RoHS Compliant
Other names
516-2122-2
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
HSMC-A101-S00J1
Manufacturer:
AVAGO
Quantity:
50 000
Part Number:
HSMC-A101-S00J1
Manufacturer:
AVAGO/安华高
Quantity:
20 000
Figure 8. Recommended Pb-free reflow soldering profile.
Figure 6. Forward voltage shift vs. temperature.
Note: For detail information on reflow soldering of Avago surface
mount LEDs, do refer to Avago Application Note AN 1060 Surface
Mounting SMT LED Indicator Components.
Figure 9. Recommended wave soldering profile.
8
-0.1
-0.2
-0.3
250
200
150
100
0.5
0.4
0.3
0.2
0.1
50
30
0
-100
217 C
200 C
150 C
0
CONVEYOR SPEED = 1.83 M/MIN (6 FT/MIN)
PREHEAT SETTING = 150C (100C PCB)
SOLDER WAVE TEMPERATURE = 245C
AIR KNIFE AIR TEMPERATURE = 390C
AIR KNIFE DISTANCE = 1.91 mm (0.25 IN.)
AIR KNIFE ANGLE = 40
LEADED SOLDER: SN63; FLUX: RMA
LEAD-FREE SOLDER: 96.5 wt% SN, 3 wt% Ag, 0.5 wt% Cu
NOTE: ALLOW FOR BOARDS TO BE SUFFICIENTLY COOLED
BEFORE EXERTING MECHANICAL FORCE.
GaP/AlGaAs/
AlInGaP
10
-50
FLUXING
20
3 C/SEC. MAX.
PREHEAT
TEMPERATURE – °C
TURBULENT WAVE
3 C/SEC. MAX.
60 - 120 SEC.
255 - 260 C
30
0
InGaN/GaN
TIME – SECONDS
40
50
TIME
50
100
60
70
(Acc. to J-STD-020C)
LAMINAR WAVE
150
HOT AIR KNIFE
BOTTOM SIDE
OF PC BOARD
TOP SIDE OF
PC BOARD
100 SEC. MAX.
10 to 30 SEC.
80
6 C/SEC. MAX.
90
100
Figure 7. Radiation Pattern.
1.0
0.8
0.6
0.4
0.2
0
-90
-80
-70
Figure 10. Recommended soldering pad pattern.
2.60
-60
-50
-40
ANGULAR DISPLACEMENT – DEGREES
SOLDER RESIST
-30
-20
1.50
-10
0
10
4.50
20 30
40
50
60
70
80
90