HLMP-QB00-S0000 Avago Technologies US Inc., HLMP-QB00-S0000 Datasheet

LED DOME INGAN BLUE STR LDS

HLMP-QB00-S0000

Manufacturer Part Number
HLMP-QB00-S0000
Description
LED DOME INGAN BLUE STR LDS
Manufacturer
Avago Technologies US Inc.

Specifications of HLMP-QB00-S0000

Viewing Angle
12°
Color
Blue
Millicandela Rating
290mcd
Current - Test
20mA
Wavelength - Dominant
468nm
Wavelength - Peak
470nm
Voltage - Forward (vf) Typ
3.7V
Lens Type
Clear
Lens Style/size
Round, 1.78mm
Package / Case
Axial, Flat Leads
Size / Dimension
2.09mm L x 2.21mm W
Height
2.92mm
Mounting Type
Through Hole
Resistance Tolerance
468nm
Led Size
2.1 mm x 2.2 mm
Illumination Color
Blue
Operating Voltage
3.7 V
Wavelength
468 nm
Luminous Intensity
290 mcd
Mounting Style
SMD/SMT
Operating Current
20 mA
Lens Dimensions
1.9 mm
Lens Shape
Dome
Maximum Operating Temperature
+ 85 C
Minimum Operating Temperature
- 40 C
Peak Wavelength
470 nm
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
Luminous Flux @ Current - Test
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
516-1901
HLMP-QB00-S0000

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
HLMP-QB00-S0000
Manufacturer:
FAIRCHIL
Quantity:
40 000
Part Number:
HLMP-QB00-S0000
Manufacturer:
AVAGO
Quantity:
50 000
HLMP-PB00-N0000 / HLMP-PM00-N0000
HLMP-QB00-S0000 / HLMP-QM00-S0000
High Power InGaN Subminiature Lamps
Reliability Data Sheet
Description
The following cumulative test results have been
obtained from testing performed at Avago
Technologies in accordance with the latest revision of
MIL-STD-883.
Avago Technologies tests parts at the absolute
maximum rated conditions recommended for the
device. The actual performance you obtain from Avago
Technologies parts depends on the electrical and
environmental characteristics of your application but
will probably be better than the performance outlined
in Table 1.
Table 1. Life Tests
Demonstrated Performance
Dome (Blue)
Dome (Green)
Colors
Stress Test
Conditions
I
I
T
T
F
F
A
A
= 30 mA
= 30 mA
= 55°C
= 55°C
Hrs.
56,000
56,000
Total Device
Units
56
56
Tested
Failure Rate Prediction
The failure rate of semiconductor devices is determined
by the junction temperature of the device. The
relationship between ambient temperature and actual
junction temperature is given by the following:
T
where
T
θ
watt
P
The estimated MTBF and failure rate at temperatures
lower than the actual stress temperature can be
determined by using an Arrhenius model for
temperature acceleration. Results of such calculations
are shown in the table on the following page using an
activation energy of 0.43 eV (reference MIL-HDBK-217).
J
A
JA
AVG
(°C) = T
= ambient temperature in °C
= thermal resistance of junction-to-ambient in °C/
= average power dissipated in watts
A
(°C) + θ
Units
Failed
0
0
JA
P
AVG
Point Typical Performance
MTBF
56,000
56,000
Failure Rate
(%/1K Hours)
≤1.79
≤1.79

Related parts for HLMP-QB00-S0000

HLMP-QB00-S0000 Summary of contents

Page 1

... HLMP-PB00-N0000 / HLMP-PM00-N0000 HLMP-QB00-S0000 / HLMP-QM00-S0000 High Power InGaN Subminiature Lamps Reliability Data Sheet Description The following cumulative test results have been obtained from testing performed at Avago Technologies in accordance with the latest revision of MIL-STD-883. Avago Technologies tests parts at the absolute maximum rated conditions recommended for the device ...

Page 2

Table 2. Reliability Predictions (I F Demonstrated Performance Ambient Junction Temperature (°C) Temperature (°C) 85 109 Notes: 1. The point typical MTBF (which represents 60% confidence level) is ...

Page 3

Table 3. Environmental Tests Test Name Temperature Cycle Humidity Life Humidity Storage Life Low Temperature Life Low Temperature Storage LIfe Room Termperature Life For product information and a complete list of distributors, please go to our web site: Avago, Avago ...

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