EHW007A0B41Z Lineage Power, EHW007A0B41Z Datasheet - Page 11

• Manufacturer Part Number: EHW007A0B41Z
• Description: CONVERTER DC/DC 12VDC 7A T/H
• Manufacturer: Lineage Power
• Series: EHW007A0Br
• Type: Power Over Ethernet (PoE)r

Specifications of EHW007A0B41Z

• Output: 12V
• Number Of Outputs: 1
• Power (watts): 84W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: Module
• 1st Output: 12 VDC @ 7A
• Size / Dimension: 2.30" L x 0.90" W x 0.32" H (58.4mm x 22.8mm x 8.1mm)
• Power (watts) - Rated: 84W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 92.5%
• Approvals: CE, CSA, EN, UL, VDE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 555-1142; CC109145100

Data Sheet
October 2, 2009
Surface Mount Information
Lead Free Soldering
The –Z version of the EHW007A0B modules are lead-
free (Pb-free) and RoHS compliant and are both
forward and backward compatible in a Pb-free and a
SnPb soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect
long-term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow Sensitivity Classification for
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using
Sn/Ag/Cu solder is shown in Figure 20.
Figure 20. Recommended linear reflow profile
using Sn/Ag/Cu solder.
MSL Rating
The EHW007A0B modules have a MSL rating of 2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages
should not be broken until time of use. Once the
original package is broken, the floor life of the product
at conditions of ≤ 30°C and 60% relative humidity
varies according to the MSL rating (see J-STD-033A).
The shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
LINEAGE
300
250
200
150
100
50
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
POWER
Peak Temp 260°C
Reflow Time (Seconds)
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
(continued)
36–75Vdc Input; 12.0Vdc Output; 7A Output Current
Cooling
Zone
EHW007A0B Series Eighth-Brick Power Modules
stored at the following conditions: < 40° C, < 90%
relative humidity.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning and
drying procedures, refer to Lineage Power Board
Mounted Power Modules: Soldering and Cleaning
Application Note (AN04-001).
Through-Hole Lead-Free Soldering
Information
The RoHS-compliant through-hole products use the
SAC (Sn/Ag/Cu) Pb-free solder and RoHS-compliant
components. They are designed to be processed
through single or dual wave soldering machines. The
pins have an RoHS-compliant finish that is compatible
with both Pb and Pb-free wave soldering processes.
A maximum preheat rate of 3 ° C/s is suggested. The
wave preheat process should be such that the
temperature of the power module board is kept below
210 ° C. For Pb solder, the recommended pot
temperature is 260 ° C, while the Pb-free solder pot is
270 ° C max. Not all RoHS-compliant through-hole
products can be processed with paste-through-hole
Pb or Pb-free reflow process. If additional information
is needed, please consult with your Lineage Power
representative for more details.
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