JC050F1 Lineage Power, JC050F1 Datasheet - Page 12

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JC050F1

Manufacturer Part Number
JC050F1
Description
CONVERTER DC/DC 3.3V 33W OUT
Manufacturer
Lineage Power
Series
JC050r
Type
Isolated with Remote On/Offr
Datasheet

Specifications of JC050F1

Output
3.3V
Number Of Outputs
1
Power (watts)
33W
Mounting Type
Through Hole
Voltage - Input
18 ~ 36V
Package / Case
9-DIP Module
1st Output
3.3 VDC @ 10A
Size / Dimension
2.40" L x 2.28" W x 0.50" H (61mm x 57.9mm x 12.7mm)
Power (watts) - Rated
33W
Operating Temperature
-40°C ~ 100°C
Efficiency
81%
Approvals
CSA, UL, VDE
Product
Isolated
Output Power
8 W
Input Voltage Range
18 V to 36 V
Input Voltage (nominal)
28 V
Output Voltage (channel 1)
3.3 V
Output Current (channel 1)
2.4 A
Isolation Voltage
1.5 KV
Package / Case Size
DIP
Output Type
Isolated
Output Voltage
3.3 V
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
3rd Output
-
2nd Output
-
4th Output
-
Lead Free Status / Rohs Status
No
JC050F, JC075F, JC100F Power Modules: dc-dc Converters;
18 Vdc to 36 Vdc Input, 3.3 Vdc Output; 33 W to 66 W
12
12
Thermal Considerations
Heat transfer Without Heat Sinks
Figure 24. JC050F Power Dissipation vs.
Figure 25. JC075F Power Dissipation vs.
12
11
10
20
18
16
14
12
10
9
8
7
6
5
4
8
6
4
2
0
1
0
1
Output Current
Output Current
2
2
3
3
OUTPUT CURRENT, I
V
V
V
4
I
I
OUTPUT CURRENT, I
I
= 27 V
= 18 V
= 36 V
V
V
V
I
I
I
4
5
= 18 V
= 28 V
= 36 V
6
5
7
8
6
(continued)
9
O
(A)
O
10
7
(A)
11
(continued)
8
12
13
9
14
8-1594
8-1595
15
10
Figure 26. JC100F Power Dissipation vs.
Heat Transfer with Heat Sinks
The power modules have through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to attach to the module. The mounting torque must not
exceed 0.56 N–m (5 in.–lb.). For a screw attachment
from the pin side, the recommended hole size on the
customer’s PWB around the mounting holes is
0.130 ± 0.005 inches. If a larger hole is used, the
mounting torque from the pin side must not exceed
0.25 N–m (2.2 in.–lb.).
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total
module thermal resistance (θca) is defined as the max-
imum case temperature rise (ΔT
module power dissipation (P
The location to measure case temperature (T
shown in Figure 22. Case-to-ambient thermal resis-
tance vs. airflow is shown, for various heat sink config-
urations and heights, in Figure 27. These curves were
obtained by experimental testing of heat sinks, which
are offered in the product catalog.
θ
24
22
20
18
16
14
12
10
ca
8
6
4
2
0
0
=
2
Output Current
ΔT
-------------------- -
P
C max
4
,
D
OUTPUT CURRENT, I
6
V
V
V
I
I
I
=
= 36 V
= 28 V
= 18 V
8
(
----------------------- -
T
D
C
10
):
P
D
Lineage Power
March 2008
C, max
T
Data Sheet
A
12
)
O
) divided by the
(A)
14
16
C
) is
18
8-1596
20

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