FW300F1 Lineage Power, FW300F1 Datasheet - Page 17
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FW300F1
Manufacturer Part Number
FW300F1
Description
CONVERTER DC/DC 3.3V 198W OUT
Manufacturer
Lineage Power
Series
FW300r
Type
Isolated with Remote On/Offr
Datasheet
1.FW250F1.pdf
(20 pages)
Specifications of FW300F1
Output
3.3V
Number Of Outputs
1
Power (watts)
198W
Mounting Type
Through Hole
Voltage - Input
36 ~ 75V
Package / Case
Module
1st Output
3.3 VDC @ 60A
Size / Dimension
4.60" L x 2.40" W x 0.53" H (116.8mm x 61mm x 13.5mm)
Power (watts) - Rated
198W
Operating Temperature
-40°C ~ 100°C
Efficiency
79%
Approvals
CE, CSA, UL, VDE
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
3rd Output
-
2nd Output
-
4th Output
-
Available stocks
Company
Part Number
Manufacturer
Quantity
Price
Company:
Part Number:
FW300F1
Manufacturer:
LUCENT
Quantity:
27
Company:
Part Number:
FW300F1
Manufacturer:
SEMIKRON
Quantity:
560
Part Number:
FW300F1
Quantity:
55
Company:
Part Number:
FW300F1-33T
Manufacturer:
EUPEC
Quantity:
560
Company:
Part Number:
FW300F1-33T198W
Manufacturer:
WE
Quantity:
4 000
Company:
Part Number:
FW300F1-T
Manufacturer:
LUCENT
Quantity:
27
Part Number:
FW300F1-T
Manufacturer:
LUCENT
Quantity:
20 000
July 2002
Thermal Considerations
Heat Transfer with Heat Sinks
Then solve the following equation:
Use Figures 27 and 28 to determine air velocity for the
0.5 inch heat sink. The minimum airflow necessary for
the FW250F1 module depends on heat sink fin orienta-
tion and is shown below:
Custom Heat Sinks
A more detailed model can be used to determine the
required thermal resistance of a heat sink to provide
necessary cooling. The total module resistance can be
separated into a resistance from case-to-sink ( cs) and
sink-to-ambient ( sa) as shown in Figure 30.
Figure 30. Resistance from Case-to-Sink and Sink-
For a managed interface using thermal grease or foils,
a value of cs = 0.1 °C/W to 0.3 °C/W is typical. The
solution for heat sink resistance is:
This equation assumes that all dissipated power must
be shed by the heat sink. Depending on the user-
defined application environment, a more accurate
model, including heat transfer from the sides and bot-
tom of the module, can be used. This equation pro-
vides a conservative estimate for such instances.
Tyco Electronics Corp..
2.0 m/s (400 ft./min.) (oriented along width)
3.0 m/s (600 ft./min.) (oriented along length)
sa
ca
ca
ca
P
=
=
=
=
D
to-Ambient
1.07
------------------------ -
T
----------------------- -
----------------------- -
T
85 40
C
P
C
T
–
P
42
D
–
°C/W
C
–
T
D
A
T
A
–
cs
cs
dc-dc Converters; 36 to 75 Vdc Input, 3.3 Vdc Output; 165 W to 198 W
T
S
(continued)
sa
(continued)
T
A
8-1304 (C)
Solder, Cleaning, and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical testing. The result
of inadequate circuit-board cleaning and drying can
affect both the reliability of a power module and the
testability of the finished circuit-board assembly. For
guidance on appropriate soldering, cleaning, and dry-
ing procedures, refer to the Board-Mounted Power
Modules Soldering and Cleaning Application Note
(AP97-021EPS).
EMC Considerations
For assistance with designing for EMC compliance,
please refer to the FLTR100V10 data sheet
(DS98-152EPS).
Layout Considerations
Copper paths must not be routed beneath the power
module standoffs. For additional layout guidelines, refer
to the FLTR100V10 data sheet (DS98-152EPS).
17