JFW050B1 Lineage Power, JFW050B1 Datasheet - Page 17

• Manufacturer Part Number: JFW050B1
• Description: CONVERTER DC/DC 12V 50W OUT
• Manufacturer: Lineage Power
• Series: JFWr
• Type: Isolatedr

Specifications of JFW050B1

• Output: 12V
• Number Of Outputs: 1
• Power (watts): 50W
• Mounting Type: Through Hole
• Voltage - Input: 36 ~ 75V
• Package / Case: Module
• 1st Output: 12 VDC @ 4.2A
• Size / Dimension: 2.40" L x 2.28" W x 0.50" H (61mm x 57.9mm x 12.7mm)
• Power (watts) - Rated: 50W
• Operating Temperature: -40°C ~ 100°C
• Efficiency: 85%
• Approvals: CE, CSA, UL, VDE
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant
• 3rd Output: -
• 2nd Output: -
• 4th Output: -

April 2008
Thermal Considerations
Heat Transfer Without Heat Sinks
Figure 30. JFW075B Power Dissipation vs.
Figure 31. JFW100B Power Dissipation vs.
Lineage Power
14
12
10
16
14
12
10
8
6
4
2
0
8
6
4
2
0
0.625
0.833
1.833 2.833 3.833
Output Current at 25 °C
Output Current at 25 °C
1.625
V
V
V
I
I
I
V
V
V
= 75 V
= 48 V
= 36 V
OUTPUT CURRENT, I
I
I
I
2.625
OUTPUT CURRENT, I
= 75 V
= 54 V
= 36 V
dc-dc Converters; 36 Vdc to 75 Input, Vdc 12 Vdc Output; 50 W to 150 W
4.833
3.625
5.833
(continued)
4625
O
(A)
O
6.833
(A)
5.625
7.833 8.833
(continued)
8-2551 (C)
8-2552 (C)
6.625
Figure 32. JFW150B Power Dissipation vs.
Heat Transfer with Heat Sinks
The power module has through-threaded, M3 x 0.5
mounting holes, which enable heat sinks or cold plates
to attach to the module. The mounting torque must not
exceed 0.56 N-m (5 in.-lb.). For a screw attachment
from the pin side, the recommended hole size on the
customer’s PWB around the mounting holes is
0.130 ± 0.005 inches. If a larger hole is used, the
mounting torque from the pin side must not exceed
0.25 N-m (2.2 in.-lb.).
Thermal derating with heat sinks is expressed by using
the overall thermal resistance of the module. Total
module thermal resistance (θca) is defined as the max-
imum case temperature rise (ΔT
module power dissipation (P
The location to measure case temperature (T
shown in Figure 27. Case-to-ambient thermal resis-
tance vs. airflow for various heat sink configurations is
shown in Figure 33. These curves were obtained by
experimental testing of heat sinks, which are offered in
the product catalog.
These measured resistances are from heat transfer
from the sides and bottom of the module as well as the
top side with the attached heat sink; therefore, the
case-to-ambient thermal resistances shown are gener-
ally lower than the resistance of the heat sink by itself.
The module used to collect the data in Figure 33 had a
thermal-conductive dry pad between the case and the
heat sink to minimize contact resistance. The use of
Figure 33 is shown in the following example.
θ
25
20
15
10
0
ca
5
1
=
2
Output Current at 25 °C
ΔT
-------------------- -
3
P
C max
,
D
4
OUTPUT CURRENT, I
5
=
6
(
----------------------- -
T
D
C
7
):
P
–
D
V
C, max
T
V
V
I
8
I
I
A
= 75 V
= 54 V
= 36 V
)
O
9
) divided by the
(A)
10
11
C
) is
12
8-2553 (C)
13
17