AXA010A0X3-SRZ Lineage Power, AXA010A0X3-SRZ Datasheet - Page 18

CONVER DC/DC 0.75 5.5V @ 10A SMD

AXA010A0X3-SRZ

Manufacturer Part Number
AXA010A0X3-SRZ
Description
CONVER DC/DC 0.75 5.5V @ 10A SMD
Manufacturer
Lineage Power
Series
Austin Lynx™r
Type
Point of Load (POL) Non-Isolated with Remote On/Offr
Datasheet

Specifications of AXA010A0X3-SRZ

Output
0.75 ~ 5.5V
Number Of Outputs
1
Power (watts)
55W
Mounting Type
Surface Mount
Voltage - Input
10 ~ 14V
Package / Case
6-SMD Module
1st Output
0.75 ~ 5.5 VDC @ 10A
Size / Dimension
1.30" L x 0.43" W x 0.33" H (33mm x 10.9mm x 8.3mm)
Power (watts) - Rated
55W
Operating Temperature
-40°C ~ 85°C
Efficiency
93%
Approvals
CSA, EN, UL, VDE
Output Power
55 W
Input Voltage Range
10 V to 14 V
Output Voltage (channel 1)
0.75 V to 5.5 V
Output Current (channel 1)
10 A
Package / Case Size
SMD
Output Type
Non-Isolated
Output Voltage
0.75 V to 5.5 V
Product
Non-Isolated / POL
Output Current
10A
Input Voltage
12V
Screening Level
Industrial
Product Length (mm)
33mm
Product Height (mm)
6.69mm
Product Depth (mm)
13.5mm
Mounting Style
Surface Mount
Pin Count
6
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
3rd Output
-
2nd Output
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
555-1061-2
CC109101326

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
AXA010A0X3-SRZ
Manufacturer:
SEC
Quantity:
3
Data Sheet
September 30, 2009
Surface Mount Information
Pick and Place
The 12V Austin Lynx Programmable SMT modules
use an open frame construction and are designed for
a fully automated assembly process. The modules
are fitted with a label designed to provide a large
surface area for pick and place operations. The label
meets all the requirements for surface mount
processing, as well as safety standards, and is able to
withstand reflow temperatures of up to 300
label also carries product information such as product
code, serial number and the location of manufacture.
Figure 33. Pick and Place Location.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Even so, these
modules have a relatively large mass when compared
to conventional SMT components. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended nozzle diameter for
reliable operation is 6mm. The maximum nozzle outer
diameter, which will safely fit within the allowable
component spacing, is 9 mm.
Oblong or oval nozzles up to 11 x 9 mm may also be
used within the space available.
Tin Lead Soldering
The Austin Lynx
free modules and can be soldered either in a lead-free
solder process or in a conventional Tin/Lead (Sn/Pb)
process. It is recommended that the customer review
data sheets in order to customize the solder reflow
profile for each application board assembly. The
following instructions must be observed when
soldering these units. Failure to observe these
LINEAGE
POWER
TM
12 V SMT power modules are lead
12V Austin Lynx
10 – 14Vdc input; 0.75Vdc to 5.5Vdc Output; 10A output current
o
C. The
TM
SMT Non-isolated Power Modules Programmable:
instructions may result in the failure of or cause
damage to the modules, and can adversely affect
long-term reliability.
In a conventional Tin/Lead (Sn/Pb) solder process
peak reflow temperatures are limited to less than
235
wets the land, and subsequently wicks the device
connection. Sufficient time must be allowed to fuse
the plating on the connection to ensure a reliable
solder joint. There are several types of SMT reflow
technologies currently used in the industry. These
surface mount power modules can be reliably
soldered using natural forced convection, IR (radiant
infrared), or a combination of convection/IR. For
reliable soldering the solder reflow profile should be
established by accurately measuring the modules CP
connector temperatures.
Figure 34. Reflow Profile for Tin/Lead (Sn/Pb)
process.
Figure 35. Time Limit Curve Above 205
Tin/Lead (Sn/Pb) process.
o
300
200
240
235
230
225
220
205
200
250
100
215
210
150
C. Typically, the eutectic solder melts at 183
50
0
0
10
Heat zo ne
max 4
P reheat zo ne
max 4
P eak Temp 235
20
REFLOW TIME (S)
o
Cs
o
So ak zo ne
30-240s
Cs
-1
-1
30
o
C
40
T
205
lim
o
above
C
o
Co o ling
zo ne
1 -4
C for
50
o
Cs
18
-1
o
60
C,

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