LSM2-T/6-W3-C Murata Power Solutions Inc, LSM2-T/6-W3-C Datasheet - Page 10
![CONV DC/DC 19.8W 6A 5V SMD](/photos/8/70/87072/lsm2-series_sml.jpg)
LSM2-T/6-W3-C
Manufacturer Part Number
LSM2-T/6-W3-C
Description
CONV DC/DC 19.8W 6A 5V SMD
Manufacturer
Murata Power Solutions Inc
Series
LSM2r
Type
Point of Load (POL) Non-Isolatedr
Datasheet
1.LSM2-T6-W3N-C.pdf
(17 pages)
Specifications of LSM2-T/6-W3-C
Output
0.75 ~ 3.3V
Number Of Outputs
1
Power (watts)
19W
Mounting Type
Surface Mount
Voltage - Input
2.4 ~ 5.5V
Package / Case
8-DIP SMD Module
1st Output
0.75 ~ 3.3 VDC @ 6A
Size / Dimension
1.30" L x 0.53" W x 0.34" H (33mm x 13.5mm x 8.6mm)
Power (watts) - Rated
19.8W
Operating Temperature
-40°C ~ 85°C
Efficiency
95.5%
Approvals
CSA, cUL, EN, UL
Dc / Dc Converter O/p Type
Variable
No. Of Outputs
1
Input Voltage
2.4V To 5.5V
Power Rating
19.8W
Output Voltage
3.3V
Output Current
6A
Approval Bodies
UL, CSA
Supply Voltage
5V
Product
Non-Isolated / POL
Output Power
20 W
Input Voltage Range
2.4 V to 5.5 V
Output Voltage (channel 1)
0.75 V to 3.3 V
Output Current (channel 1)
6 A
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
3rd Output
-
2nd Output
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
811-1781-2
Tape & Reel Surface Mount Package
MPS’s LSM2 series DC/DC converters are the only higher-current (16A) SMT
DC/DC's that can be automatically “pick-and-placed” using standard vacuum-
pickup equipment (nozzle size and style, vacuum pressure and placement
speed may need to be optimized for automated pick and place) and subse-
quently refl owed using high-temperature, lead-free solder.
sembled by their vendors with high-temperature solder (usually Sn96.5/Ag3.5
with a melting point +221°C) so that you may attach them to your board using
low-temperature solder (usually Sn63/Pb37 with a melting point of +183°C).
Conceptually straightforward, this "stepped" solder approach has its limita-
tions, and it is clearly out of step with an industry trending toward the broad
use of lead-free solders. Are you to experiment and develop refl ow profi les
from other vendors that ensure the components on those DC/DC never exceed
215-216°C? If those components get too hot, "double-refl ow" could compro-
mise the reliability of their solder joints. Virtually all these devices demand you
"cool down" the Sn63 profi le you are likely using today.
Virtually all SMT DC/DCs today are unprotected "open-frame" devices as-
250
200
183
150
100
221
50
0
50
Sn96.5/Ag3.5 Melting Point
Sn63/Pb37 Melting Point
100
PCB TEMPERATURE INSIDE THE HEAT SHIELD
150
www.murata-ps.com
Figure 6. Refl ow Solder Profi le
Time (Seconds)
200
magic solders no one else has. Nevertheless, we have a simple and practical,
straightforward approach that works. We assemble our LSM2 SMT DC/DC's
using a high-temperature (+216°C), lead-free alloy (Sn96.2%, Ag2.5%, Cu0.8%,
Sb0.5%). The LSM2 design ensures co-planarity to within 0.004 inches
(100μ1m) of the unit's tin-plated (150 micro-inches) copper leads. See Me-
chanical Data for additional information.
ing the package leads, provides thermal insulation to internal components
during refl ow and its smooth surface ideally doubles as the vacuum pick-up
location also. The insulation properties of the heat shield are so effective
that temperature differentials as high as 50°C develop inside-to-outside the
shield. Oven temperature profi les with peaks of 250-260°C and dwell times
exceeding 2 minutes above 221°C (the melting point of Sn96.5/Ag3.5) are
easily achieved.
MPS is not exempted from the Laws of Physics, and we do not have
The disposable heat shield (patent pending), which has a cutaway expos-
250
HEAT SHIELD OUTSIDE TEMPERATURE
Selectable-Output POL DC/DC Converters
25 Jun 2010
300
Single Output, Non-Isolated
MDC_LSM2
350
LSM2 Series
email: sales@murata-ps.com
Series.B09Δ
400
Page 10 of 17