APTS012A0X3-SRZ Lineage Power, APTS012A0X3-SRZ Datasheet - Page 25

• Manufacturer Part Number: APTS012A0X3-SRZ
• Description: CONV DC-DC 0.69 5.5V @ 12A SMD
• Manufacturer: Lineage Power
• Series: Micro TLynx™r
• Type: Point of Load (POL) Non-Isolated with Remote On/Offr

Specifications of APTS012A0X3-SRZ

• Output: 0.69 ~ 5.5V
• Number Of Outputs: 1
• Power (watts): 66W
• Mounting Type: Surface Mount
• Voltage - Input: 4.5 ~ 14V
• Package / Case: 10-SMD Module
• 1st Output: 0.69 ~ 5.5 VDC @ 12A
• Size / Dimension: 0.80" L x 0.45" W x 0.33" H (20.3mm x 11.4mm x 8.5mm)
• Power (watts) - Rated: 66W
• Operating Temperature: -40°C ~ 85°C
• Efficiency: 94%
• Approvals: CSA, EN, UL, VDE
• Output Power: 66 W
• Input Voltage Range: 4.5 V to 14 V
• Output Voltage (channel 1): 0.69 V to 5.5 V
• Output Current (channel 1): 12 A
• Package / Case Size: SMD
• Output Type: Non-Isolated
• Output Voltage: 0.69 V to 5.5 V
• Product: Non-Isolated / POL
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant
• Other names: 555-1129-2

Data Sheet
December 2, 2010
Surface Mount Information
Pick and Place
The 12V Micro TLynx
construction and are designed for a fully automated
assembly process. The modules are fitted with a label
designed to provide a large surface area for pick and
place operations. The label meets all the requirements
for surface mount processing, as well as safety
standards, and is able to withstand reflow
temperatures of up to 300
product information such as product code, serial
number and the location of manufacture.
Nozzle Recommendations
The module weight has been kept to a minimum by
using open frame construction. Variables such as
nozzle size, tip style, vacuum pressure and placement
speed should be considered to optimize this process.
The minimum recommended inside nozzle diameter
for reliable operation is 3mm. The maximum nozzle
outer diameter, which will safely fit within the allowable
component spacing, is 7 mm.
Bottom Side / First Side Assembly
This module is not recommended for assembly on the
bottom side of a customer board. If such an assembly
is attempted, components may fall off the module
during the second reflow process. If assembly on the
bottom side is planned, please contact Lineage Power
for special manufacturing process instructions.
Only ruggedized (-D version) modules with additional
epoxy will work with a customer’s first side assembly.
For other versions, first side assembly should be
avoided
Lead Free Soldering
The 12V Micro TLynx
free) and RoHS compliant and fully compatible in a Pb-
free soldering process. Failure to observe the
instructions below may result in the failure of or cause
damage to the modules and can adversely affect long-
term reliability.
Pb-free Reflow Profile
Power Systems will comply with J-STD-020 Rev. C
(Moisture/Reflow
Nonhermetic Solid State Surface Mount Devices) for
both Pb-free solder profiles and MSL classification
procedures. This standard provides a recommended
forced-air-convection reflow profile based on the
volume and thickness of the package (table 4-2). The
suggested Pb-free solder paste is Sn/Ag/Cu (SAC).
The recommended linear reflow profile using Sn/Ag/Cu
solder is shown in Fig. 51. Soldering outside of the
recommended profile requires testing to verify results
and performance. For questions regarding Land grid
LINEAGE
POWER
Sensitivity
TM
TM
modules use an open frame
modules are lead-free (Pb-
o
C. The label also carries
4.5 – 14Vdc input; 0.69Vdc to 5.5Vdc output; 12A output current
Classification
12V Micro TLynx
for
array(LGA) soldering, solder volume; please contact
Lineage Power for special manufacturing process
instructions
MSL Rating
The 12V Micro TLynx
2.
Storage and Handling
The recommended storage environment and handling
procedures for moisture-sensitive surface mount
packages is detailed in J-STD-033 Rev. A (Handling,
Packing, Shipping and Use of Moisture/Reflow
Sensitive Surface Mount Devices). Moisture barrier
bags (MBB) with desiccant are required for MSL
ratings of 2 or greater. These sealed packages should
not be broken until time of use. Once the original
package is broken, the floor life of the product at
conditions of ≤ 30°C and 60% relative humidity varies
according to the MSL rating (see J-STD-033A). The
shelf life for dry packed SMT packages will be a
minimum of 12 months from the bag seal date, when
stored at the following conditions: < 40° C, < 90%
relative humidity.
Figure 51. Recommended linear reflow profile
using Sn/Ag/Cu solder.
Post Solder Cleaning and Drying
Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The
result of inadequate cleaning and drying can affect
both the reliability of a power module and the testability
of the finished circuit-board assembly. For guidance on
appropriate soldering, cleaning and drying procedures,
refer to Board Mounted Power Modules: Soldering and
Cleaning Application Note (AN04-001).
TM
300
250
200
150
100
50
: Non-isolated DC-DC Power Modules
0
Per J-STD-020 Rev. C
Heating Zone
1°C/Second
Peak Temp 260°C
TM
Reflow Time (Seconds)
modules have a MSL rating of
* Min. Time Above 235°C
*Time Above 217°C
15 Seconds
60 Seconds
Cooling
Zone
25