LTM4606IV#PBF Linear Technology, LTM4606IV#PBF Datasheet - Page 19

• Manufacturer Part Number: LTM4606IV#PBF
• Description: IC DC/DC UMODULE 6A 133-LGA
• Manufacturer: Linear Technology
• Series: µModuler
• Type: Point of Load (POL) Non-Isolatedr

Specifications of LTM4606IV#PBF

• Design Resources: LTM4606 Spice Model
• Output: 0.6 ~ 5 V
• Number Of Outputs: 1
• Power (watts): 30W
• Mounting Type: Surface Mount
• Voltage - Input: 4.5 ~ 28 V
• Package / Case: 133-LGA
• 1st Output: 0.6 ~ 5 VDC @ 6A
• Size / Dimension: 0.59" L x 0.59" W x 0.11" H (15mm x 15mm x 2.8mm)
• Power (watts) - Rated: 30W
• Operating Temperature: -40°C ~ 125°C
• Efficiency: 93%
• Dc To Dc Converter Type: Non-Inverting/Inverting/Step Up/Step Down
• Pin Count: 133
• Input Voltage: 28V
• Output Voltage: 0.6 to 5V
• Switching Freq: 900KHz
• Output Current: 6A
• Package Type: LGA
• Isolation Voltage: Not RequiredV
• Output Type: Adjustable
• Switching Regulator: Yes
• Load Regulation: 0.3%
• Line Regulation: 0.3%
• Mounting: Surface Mount
• Input Voltage (min): 4.5V
• Operating Temperature Classification: Automotive
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• 3rd Output: -
• 2nd Output: -
• Lead Free Status / Rohs Status: Compliant

applicaTions inForMaTion
Table 3. 1.5V Output
DERATING CURVE
Figures 8, 10
Figures 8, 10
Figures 8, 10
Figures 9, 11
Figures 9, 11
Figures 9, 11
Table 4. 3.3V Output
DERATING CURVE
Figures 12, 14
Figures 12, 14
Figures 12, 14
Figures 13, 15
Figures 13, 15
Figures 13, 15
Heat Sink Manufacturer
Wakefield Engineering
Layout Checklist/Example
The high integration of LTM4606 makes the PCB board
layout very simple and easy. However, to optimize its
electrical and thermal performance, some layout con-
siderations are still necessary.
• Use large PCB copper areas for high current path, in-
• Place high frequency ceramic input and output capaci-
• Place a dedicated power ground layer underneath the
• Use round corners for the PCB copper layer to minimize
• To minimize the EMI noise and reduce module thermal
• Do not put vias directly on pads, unless they are capped.
cluding V
PCB conduction loss and thermal stress.
tors next to the V
high frequency noise.
unit.
the radiated noise.
stress, use multiple vias for interconnection between
top layer and other power layers on different locations.
IN
, PGND and V
D
, PGND and V
V
V
12, 24
12, 24
12, 24
12, 24
12, 24
12, 24
5, 12
5, 12
5, 12
5, 12
5, 12
5, 12
IN
IN
OUT
(V)
(V)
. It helps to minimize the
OUT
pins to minimize
Part No: LTN20069
POWER LOSS CURVE
POWER LOSS CURVE
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
Figure 6
Figure 7
Figure 7
Figure 7
Figure 7
Figure 7
Figure 7
• Use a separated SGND ground copper area for com-
• Place one or more high frequency ceramic capacitors
Figure 17 gives a good example of the recommended
layout. For load current below 3A, decouple the input and
output grounds. Use vias to connect GND pads to the
bottom layer, then connect to the right side of the module
as the output GND.
AIR FLOW (LFM)
AIR FLOW (LFM)
ponents connected to signal pins. Connect the SGND
to PGND underneath the unit.
close to the connection into the system board.
V
GND
V
OUT
IN
200
400
200
400
200
400
200
400
0
0
0
0
C
OUT
C
IN
Figure 17. Recommended PCB Layout
C
OUT
C
IN
Phone: [phone]
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
BGA Heat Sink
HEAT SINK
HEAT SINK
None
None
None
None
None
None
LTM4606
θ
θ
JA
JA
13.5
13.5
9.5
(°C/W)
10
(°C/W)
11
10
10
4606 F17
9
7
5
7
5
19
SIGNAL
GND
4606fb