NH020F5 Lineage Power, NH020F5 Datasheet - Page 14
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NH020F5
Manufacturer Part Number
NH020F5
Description
CONVERTER DC/DC 3.3V 20W OUT
Manufacturer
Lineage Power
Series
NH020r
Type
Point of Load (POL) Non-Isolated with Remote On/Offr
Datasheet
1.NH020F.pdf
(17 pages)
Specifications of NH020F5
Output
3.3V
Number Of Outputs
1
Power (watts)
20W
Mounting Type
Through Hole
Voltage - Input
4.5 ~ 5.5V
Package / Case
9-SIP Module
1st Output
3.3 VDC @ 6A
Size / Dimension
2.50" L x 0.24" W x 0.55" H (63.5mm x 6.1mm x 14mm)
Power (watts) - Rated
20W
Operating Temperature
-40°C ~ 115°C
Efficiency
86%
Approvals
CSA, UL, VDE
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
3rd Output
-
2nd Output
-
Lineage Power
Through-Hole Lead-Free Soldering Infor-
mation
The RoHS-compliant through-hole products use the SAC
(Sn/Ag/Cu) Pb-free solder and RoHS-compliant compo-
nents. They are designed to be processed through single or
dual wave soldering machines. The pins have an RoHS-
compliant finish that is compatible with both Pb and Pb-free
wave soldering processes. A maximum preheat rate of 3°C/s
is suggested. The wave preheat process should be such
that the temperature of the power module board is kept
below 210°C. For Pb solder, the recommended pot temper-
ature is 260°C, while the Pb-free solder pot is 270°C max.
Not all RoHS-compliant through-hole products can be pro-
cessed with paste-through-hole Pb or Pb-free reflow pro-
cess. If additional information is needed, please consult with
your Tyco Electronics Power System representative for more
details.
Post Solder Cleaning and Drying Considerations
Post solder cleaning is usually the final circuit-board
assembly process prior to electrical board testing. The result
of inadequate cleaning and drying can affect both the
reliability of a power module and the testability of the
finished circuit-board assembly. For guidance on appropriate
soldering, cleaning and drying procedures, refer to Tyco
Electronics Board Mounted Power Modules: Soldering and
Cleaning Application Note (AP01-056EPS).
Solder Ball and Cleanliness Requirements
The open frame (no case or potting) power module will meet
the solder ball requirements per J-STD-001B. These
requirements state that solder balls must neither be loose
nor violate the power module minimum electrical spacing.
The cleanliness designator of the open frame power module
is C00 (per J specification).
Data Sheet
March 28, 2008
5 Vdc Input; 1.5 Vdc to 3.3 Vdc Output; 20 W
NH020-Series Power SIPs:
14