XLT28SO-1 Microchip Technology, XLT28SO-1 Datasheet - Page 25

• Manufacturer Part Number: XLT28SO-1
• Description: SOCKET TRANSITION 28SOIC 300MIL
• Manufacturer: Microchip Technology

Specifications of XLT28SO-1

• Module/board Type: *
• Svhc: No SVHC (15-Dec-2010)
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• For Use With/related Products: MPLAB™ICE
• For Use With: AC162067 - HEADER INTRFC MPLAB ICD2 40/28PDAF18-4 - DEVICE ADAPTER FOR ICE4000DAF30-4 - DEVICE ATP FOR ICE4000DVA18XP280 - DEVICE ADAPTER 18F2220 PDIP 28LDDVA16XP280 - ADAPTER DEVICE FOR MPLAB-ICEICE2000 - EMULATOR MPLAB-ICE 2000 POD
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

XLT20QFN-1 Soldering Suggestions
This socket is difficult to solder since the device pins
are not exposed, but embedded, into the socket’s
Surface Foot (SF).
1.
2.
3.
4.
5.
You are now ready to attach the QFN header to the SF.
 2010 Microchip Technology Inc.
To start, add tack flux to the target land pattern.
Visually align the QFN SF with the target land
pattern. Then solder two opposite SF pins to the
target lands so that the SF does not move
around.
Finish soldering the rest of the SF pins.
If the SF has a middle ground pin, feed solder
through the bottom side of hte target board via
holes. This will connect the center QFN SF pin
to the target board.
Check each solder connection on the QFN SF
pins.
Transition Socket Specification
DS51194S-page 25