XLT18SO-1 Microchip Technology, XLT18SO-1 Datasheet - Page 4

• Manufacturer Part Number: XLT18SO-1
• Description: SOCKET TRANSITION 18SOIC 300MIL
• Manufacturer: Microchip Technology

Specifications of XLT18SO-1

• Module/board Type: *
• Svhc: No SVHC (15-Dec-2010)
• Lead Free Status / RoHS Status: Not applicable / Not applicable
• For Use With/related Products: MPLAB™ICE
• For Use With: AC162083 - HEADER MPLAB ICD2 PIC16F616 8/14DVA1006 - DEVICE ADAPTER ICE2000 18DIPDVA1001 - ADAPTER FOR PIC16F716 18DIPDAF18-4 - DEVICE ADAPTER FOR ICE4000DAF30-4 - DEVICE ATP FOR ICE4000AC162054 - HEADER INTERFACE ICD2 16F716DVA18XP180 - DEVICE ADAPTER 18F1320 PDIP 18LDAC162053 - HEADER INTERFACE ICD,ICD2 18DIPDVA16XP185 - ADAPTER DEVICE ICE 18DIP/SOICDVA16XP183 - ADAPTER ICE 18DIP/SOIC/SSOPDVA16XP182 - ADAPTR 712,716 DIP,SOIC,SSOPDVA16XP180 - ADAPTER DEVICE FOR MPLAB-ICEDVA12XP080 - ADAPTER DEVICE FOR MPLAB-ICE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Not applicable / Not applicable

Transition Socket Specification
TRANSITION SOCKET
APPLICATIONS – COMMENTS
AND SUGGESTIONS
Attention to component placement should be consid-
ered in mating the adapter sockets to the SOIC/SSOP
headers.
The placement of vias around the Surface Mount
Technology (SMT) layout area should be examined.
Vias immediately adjacent to the end of a SMT pad
may inadvertently come into contact with the header
leads. Vias should be placed along the center line of
the SMT pad to lessen the chance of pin-to-pin shorts
while soldering.
Care should be taken when soldering some transition
sockets to target boards. See the releated section for
specific instructions.
For information on packaging dimensions, please refer
to the Packaging Specification (DS00049).
DS51194S-page 4
GLOSSARY
Terms used in this document:
DFN – Dual Flat No lead
DIP – Dual In-line Package
MQFP – Metric Quad Flat Pack
PDIP – Plastic Dual In-line Package
PLCC – Plastic Leaded Chip Carrier
QFN – Quad Flat No lead
QFP – Quad Flat Pack
SOIC – Small Outline IC
SOT – Small Outline Transistor
SSOP – Shrink Small Outline Package
TQFP – Thin Quad Flat Pack
 2010 Microchip Technology Inc.