VDIP1 FTDI, Future Technology Devices International Ltd, VDIP1 Datasheet - Page 2

• Manufacturer Part Number: VDIP1
• Description: MOD MCU-USB HOST CTLR 24-DIP
• Manufacturer: FTDI, Future Technology Devices International Ltd
• Series: Vinculumr

Specifications of VDIP1

• Main Purpose: Interface, USB 2.0 Host/Controller
• Embedded: Yes, ASIC
• Utilized Ic / Part: VNC1L-1A
• Primary Attributes: Single A-Type Connector, UART / Parallel FIFO / SPI Interfaces
• Secondary Attributes: Second USB Port is Available via Pins, Traffic LEDs
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Other names: 768-1001

Document Reference No.: FT_000016
VDIP1 Vinculum VNC1L Module Datasheet Version 1.01
Clearance No.: FTDI# 131
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Introduction
The VDIP1 module is an MCU to embedded USB host controller development module for the VNC1L IC
device. The VDIP1 is supplied on a PCB designed to fit into a 24 pin DIP socket, and provides access to
the UART, parallel FIFO, and SPI interface pins on the VNC1L device, via its AD and AC bus pins. Not only
is it ideal for developing and rapid prototyping of VNC1L designs, but also an attractive quantity discount
structure makes this module suitable for incorporation into low and medium volume finished product
designs.
Figure 1.1-
VDIP1
The Vinculum VNC1L is the first of FTDI’s Vinculum family of Embedded USB host controller integrated
circuit devices. Not only is it able to handle the USB Host Interface, and data transfer functions but owing
to the inbuilt MCU and embedded Flash memory, Vinculum can encapsulate the USB device classes as
well. When interfacing to mass storage devices such as USB Flash drives, Vinculum also transparently
handles the FAT File structure communicating via UART, SPI or parallel FIFO interfaces via a simple to
implement command set. Vinculum provides a new cost effective solution for providing USB Host
capability into products that previously did not have the hardware resources available. The VNC1L is
available in Pb-free (RoHS compliant) compact 48-Lead LQFP package.
Copyright © 2010 Future Technology Devices International Limited
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