MCP6XXXDM-FLTR Microchip Technology, MCP6XXXDM-FLTR Datasheet - Page 32

KIT DEMO BOARD ACTIVE FILTER

MCP6XXXDM-FLTR

Manufacturer Part Number
MCP6XXXDM-FLTR
Description
KIT DEMO BOARD ACTIVE FILTER
Manufacturer
Microchip Technology
Datasheet

Specifications of MCP6XXXDM-FLTR

Main Purpose
Filters, Active - Bandpass, Highpass, Lowpass
Embedded
Yes, MCU, 8-Bit
Utilized Ic / Part
MCP6271
Primary Attributes
Cascadable PCBs, Single Supply
Secondary Attributes
Bessel, Butterworth, and Chebyshev, with Order 1 ~ 8
Processor To Be Evaluated
MCP6271
Lead Free Status / RoHS Status
Not applicable / Not applicable
Lead Free Status / RoHS Status
Lead free / RoHS Compliant, Not applicable / Not applicable

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Company
Part Number
Manufacturer
Quantity
Price
Part Number:
MCP6XXXDM-FLTR
Manufacturer:
MICROCHIP
Quantity:
12 000
Part Number:
MCP6XXXDM-FLTR
Manufacturer:
MICROCHIP/微芯
Quantity:
20 000
4.6
DS51614A-page 28
USING 8-PIN SOIC OP AMPS
There are two options available when using single op amps in SOIC-8 packages (150
mil wide); soldering onto the V
or soldering it onto a separate board which is connected to the DIP-8 socket.
Figure 4-3 shows a SOIC-8 op amp soldered onto the Active Filter Section Board.
FIGURE 4-3:
Board.
Figure 4-4 shows a SOIC-8 op amp and a DIP-8 socket, soldered onto the 8-Pin
SOIC/MSOP/TSSOP/DIP Evaluation Board available from Microchip Technology Inc
(order # SOIC8EV). The two interconnect strips on the bottom are Samtec part #
BBS-14-T-B or equivalent and are soldered into the through holes for the DIP-8 socket.
Figure 4-5 shows this board plugged into the Active Filter Section Board.
FIGURE 4-4:
Note:
Note:
The DIP-8 socket must be empty; only one op amp can be used at a time.
Insert the interconnect strips into the DIP-8 socket on the V
tion or Active Filter Section board. Place the SOIC8EV board on the top of
the interconnect strips with the same pin orientation. Now solder the strips
to the top board; this procedure ensures correct alignment of the strips. Clip
the pins flush with the top surface of the SOIC8EV board, then solder the
SOIC-8 op amp on the top.
(Front View)
Op Amp in SOIC-8 package soldered onto Active Filter Section
Op Amp in SOIC-8 package soldered to a separate board.
DD
/2 Filter Section and/or Active Filter Section board(s)
(Back View)
© 2006 Microchip Technology Inc.
DD
/2 Filter Sec-

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