AD9516-4/PCBZ Analog Devices Inc, AD9516-4/PCBZ Datasheet - Page 54
![BOARD EVAL FOR AD9516-4 1.8GHZ](/photos/9/5/90516/ad9516-4_pcbz_sml.jpg)
AD9516-4/PCBZ
Manufacturer Part Number
AD9516-4/PCBZ
Description
BOARD EVAL FOR AD9516-4 1.8GHZ
Manufacturer
Analog Devices Inc
Specifications of AD9516-4/PCBZ
Main Purpose
Timing, Clock Generator
Embedded
No
Utilized Ic / Part
AD9516-4
Primary Attributes
2 Inputs, 14 Outputs, 1.6GHz VCO
Secondary Attributes
CMOS, LVDS, LVPECL Output Logic, ADIsimCLK™ Graphical User Interface
Silicon Manufacturer
Analog Devices
Application Sub Type
PLL Clock Synthesizer
Kit Application Type
Clock & Timing
Silicon Core Number
AD9516-0, AD9516-1, AD9516-2
Silicon Family Name
AD9516-X
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
AD9516-4
THERMAL PERFORMANCE
Table 51. Thermal Parameters for the 64-Lead LFCSP
Symbol
θ
θ
θ
Ψ
θ
Ψ
The AD9516 is specified for a case temperature (T
that T
Use the following equation to determine the junction
temperature on the application PCB:
where:
T
T
top center of the package.
Ψ
PD is the power dissipation of the device (see Table 17).
JA
JMA
JMA
JC
J
CASE
JB
JT
JT
is the junction temperature (°C).
is the value from Table 51.
T
is the case temperature (°C) measured by the user at the
CASE
J
= T
is not exceeded, an airflow source can be used.
CASE
Thermal Characteristic Using a JEDEC JESD51-7 Plus JEDEC JESD51-5 2S2P Test Board
Junction-to-ambient thermal resistance, natural convection per JEDEC JESD51-2 (still air)
Junction-to-ambient thermal resistance, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-ambient thermal resistance, 2.0 m/sec airflow per JEDEC JESD51-6 (moving air)
Junction-to-board characterization parameter, 1.0 m/sec airflow per JEDEC JESD51-6 (moving air)
and JEDEC JESD51-8
Junction-to-case thermal resistance (die-to-heat sink) per MIL-STD-883, Method 1012.1
Junction-to-top-of-package characterization parameter, natural convection per JEDEC JESD51-2 (still air)
+ (Ψ
JT
× PD)
CASE
). To ensure
Rev. A | Page 54 of 80
Values of θ
design considerations. θ
approximation of T
where T
Values of θ
design considerations when an external heat sink is required.
Values of Ψ
design considerations.
T
J
= T
A
is the ambient temperature (°C).
A
JA
JC
JB
+ (θ
are provided for package comparison and PCB
are provided for package comparison and PCB
are provided for package comparison and PCB
JA
× PD)
J
by the following equation:
JA
can be used for a first-order
Value (°C/W)
22.0
19.2
17.2
11.6
1.3
0.1