MCP3901EV-MCU16 Microchip Technology, MCP3901EV-MCU16 Datasheet - Page 4

BOARD EVAL FOR 2CH ADC MCP3901

MCP3901EV-MCU16

Manufacturer Part Number
MCP3901EV-MCU16
Description
BOARD EVAL FOR 2CH ADC MCP3901
Manufacturer
Microchip Technology

Specifications of MCP3901EV-MCU16

Number Of Adc's
2
Number Of Bits
24
Data Interface
SPI™
Inputs Per Adc
1 Differential
Input Range
±1 V
Voltage Supply Source
Analog and Digital
Operating Temperature
-40°C ~ 85°C
Utilized Ic / Part
MCP3901
Silicon Manufacturer
Microchip
Application Sub Type
ADC
Kit Application Type
Data Converter
Silicon Core Number
MCP3901, PIC24F, PIC24H, DsPIC33, PIC18F86J55
Kit Contents
Board
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
MCP3901 ADC Evaluation Board for 16-Bit MCUs User’s Guide
Appendix A. Schematics and Layouts
Appendix B. Bill Of Materials (BOM)
Worldwide Sales and Service .....................................................................................38
DS51845B-page 4
A.1 Introduction .................................................................................................. 25
A.2 Schematic – Analog ..................................................................................... 26
A.3 Schematic – LCD and UART ...................................................................... 27
A.4 Schematic – USB and Memory .................................................................... 28
A.5 Schematic – Microcontroller (MCU) ............................................................. 29
A.6 Schematic – PIM Module ............................................................................. 30
A.7 Schematic – Power ...................................................................................... 31
A.8 Board – Top Trace and Top Silk .................................................................. 32
A.9 Board – Bottom Trace and Bottom Silk ........................................................ 32
A.10 Board – Layer #2 VDD .............................................................................. 33
A.11 Board – Layer #3 GND .............................................................................. 33
A.12 Board – Top Silk and Pads ........................................................................ 34
A.13 Board – Bottom Top Silk and Pads ............................................................ 34
 2010 Microchip Technology Inc.

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