EDK2378 Renesas Electronics America, EDK2378 Datasheet - Page 3

DEV EVAL KIT FOR H8S/2378

EDK2378

Manufacturer Part Number
EDK2378
Description
DEV EVAL KIT FOR H8S/2378
Manufacturer
Renesas Electronics America
Series
H8®r
Type
MCUr
Datasheets

Specifications of EDK2378

Contents
2G (Second-generation) Evaluation Board, HEW debugger support, Cable and CD-ROM
For Use With/related Products
H8S/2378
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
1.
2.1. INSTALLING THE EVALUATION DEVELOPMENT KIT (EDK)........................................................................... 4
2.2. SERIAL CONNECTION ....................................................................................................................................... 4
2.3. POWER SUPPLY ................................................................................................................................................ 4
3.1. EDK BLOCK DIAGRAM....................................................................................................................................... 5
4.1. USER INTERFACE.............................................................................................................................................. 6
4.2. SERIAL INTERFACE........................................................................................................................................... 6
4.3. SRAM................................................................................................................................................................... 7
4.4. MEMORY MAP .................................................................................................................................................... 8
4.5. SRAM ACCESS TIMING ..................................................................................................................................... 8
4.6. LEDS.................................................................................................................................................................... 8
5.1. JUMPER LINKS................................................................................................................................................... 9
5.2. USER MODE SETTINGS – CJ5........................................................................................................................ 10
5.3. EDK OPTIONS – CJ4 ........................................................................................................................................ 10
5.4. SERIAL PORT SELECTION.............................................................................................................................. 11
5.5. FLASH PROGRAMMING HEADER .................................................................................................................. 11
5.6. EXTERNAL DEBUG HEADER .......................................................................................................................... 12
5.7. BOOT CONTROL .............................................................................................................................................. 12
6.1. HEADER J1 ....................................................................................................................................................... 14
6.2. HEADER J2 ....................................................................................................................................................... 15
7.1. HMON ................................................................................................................................................................ 16
7.2. HEW3 WORKSPACE FOR KERNEL GENERATION AND MODIFICATION.................................................... 18
7.3. ADDITIONAL INFORMATION ........................................................................................................................... 18
1.
2.
3.
4.
5.
6.
7.
T
T
S
EDK B
EDK O
B
M
C
ABLE OF
ABLE OF
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OARD
ODE
ICROCONTROLLER
D
-
UP
OARD
PERATION
O
EVELOPMENT
PTIONS
C
I
NSTRUCTIONS
ONTENTS
C
L
AYOUT
ONTENTS
.................................................................................................................................................... 9
................................................................................................................................................... 6
H
............................................................................................................................................. 3
........................................................................................................................................... 16
............................................................................................................................................ 5
EADER
....................................................................................................................................... 4
C
ONNECTIONS
......................................................................................................... 14
3

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