RCDK8C Renesas Electronics America, RCDK8C Datasheet - Page 4

• Manufacturer Part Number: RCDK8C
• Description: KIT DEV EVAL FOR CAN R8C/23
• Manufacturer: Renesas Electronics America
• Type: MCUr

Specifications of RCDK8C

• Contents: 2 Target Boards with CAN Transceiver, E8 Emulator, Cables and CD-ROM
• For Use With/related Products: R8C/23
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

Table of Contents
Chapter 1. Preface .................................................................................................................................................. 1
Chapter 2. Purpose ................................................................................................................................................. 2
Chapter 3. Power Supply ........................................................................................................................................ 3
Chapter 4. Board Layout ......................................................................................................................................... 4
Chapter 5. Block Diagram ....................................................................................................................................... 6
Chapter 6. User Circuitry......................................................................................................................................... 7
Chapter 7. Modes.................................................................................................................................................. 14
Chapter 8. Programming Methods........................................................................................................................ 15
Chapter 9. Headers............................................................................................................................................... 16
Chapter 10. Code Development ........................................................................................................................... 20
Chapter 11. Component Placement...................................................................................................................... 22
Chapter 12. Additional Information ....................................................................................................................... 23
3.1. Requirements ............................................................................................................................................... 3
3.2. Power – Up Behaviour ................................................................................................................................. 3
4.1. Component Layout ....................................................................................................................................... 4
4.2. Board Dimensions ........................................................................................................................................ 5
6.1. Switches ....................................................................................................................................................... 7
6.2. LEDs ............................................................................................................................................................. 7
6.3. Potentiometer ............................................................................................................................................... 7
6.4. Serial port ..................................................................................................................................................... 8
6.5. LCD Module.................................................................................................................................................. 8
6.6. Option Links.................................................................................................................................................. 9
6.7. Oscillator Sources ...................................................................................................................................... 13
6.8. Reset Circuit ............................................................................................................................................... 13
6.9. LIN Interface ............................................................................................................................................... 13
6.10. CAN Interface ........................................................................................................................................... 13
7.1. Boot mode .................................................................................................................................................. 14
7.2. Single chip mode ........................................................................................................................................ 14
9.1. Microcontroller Headers ............................................................................................................................. 16
9.2. Application Headers ................................................................................................................................... 18
10.1. Overview................................................................................................................................................... 20
10.2. Mode Support ........................................................................................................................................... 20
10.3. Breakpoint Support................................................................................................................................... 20
10.4. Memory Map............................................................................................................................................. 21
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