KIT33291DWEVB Freescale Semiconductor, KIT33291DWEVB Datasheet - Page 22

• Manufacturer Part Number: KIT33291DWEVB
• Description: KIT EVAL FOR MC33291 SMART SW
• Manufacturer: Freescale Semiconductor

Specifications of KIT33291DWEVB

• Main Purpose: Power Management, Low Side Driver (Internal FET)
• Embedded: No
• Utilized Ic / Part: MC33291
• Primary Attributes: 8 Channel Internal Switch
• Secondary Attributes: Overvoltage, Short-Circuit & Thermal Protection
• Lead Free Status / RoHS Status: Contains lead / RoHS non-compliant

number of outputs enabled at any one time. At 25°C the
R
junction temperature to remain below 150°C, the maximum
available power dissipation must decrease as the ambient
22
33291
FUNCTIONAL DESCRIPTION
DS(ON)
The total power dissipation available is dependent on the
in 450 m with a coefficient of 6500 ppm/°C. For the
*
24-Lead
Package
SOIC
= °C/W, F = W s/°C, I PWR = W, and V A = °C
I PWR (Steady State or Transient)
(1.0 A = 1.0 W of Device Power Dissipation)
R d0
Rdx
( )*
7.0
Output 0
C d0
0.002
C
(F)*
dx
Figure 22. Thermal Model (Electrical Equivalent)
R d1
R
( )*
33
pkg
Output 1
R pkg = R leads + R PC Board
C d1
C
0.15
(F)*
pkg
R d2
Output 2
temperature increases.
of current at ambient temperatures necessary when one,
four, or eight outputs are enable ON.
how the R
temperature.
C d2
Flag Temperature Node
Junction Temperature Node
V D - T D (C°)
(Volts represent Die Surface Temperature)
Ambient Temperature Node
V A = T A (C°)
(1.0 V = 1°C Ambient Temperature)
DS(ON)
C pkg = C flag + C PC Board
output value is affected by junction
Output 6
Analog Integrated Circuit Device Data
Figure 23
R d6
C d6
depicts the per output limit
Freescale Semiconductor
Output 7
Figure 25
R d7
illustrates
C d7