IRF3315 International Rectifier, IRF3315 Datasheet

MOSFET N-CH 150V 27A TO-220AB

IRF3315

Manufacturer Part Number
IRF3315
Description
MOSFET N-CH 150V 27A TO-220AB
Manufacturer
International Rectifier
Series
HEXFET®r
Datasheet

Specifications of IRF3315

Fet Type
MOSFET N-Channel, Metal Oxide
Fet Feature
Standard
Rds On (max) @ Id, Vgs
70 mOhm @ 12A, 10V
Drain To Source Voltage (vdss)
150V
Current - Continuous Drain (id) @ 25° C
27A
Vgs(th) (max) @ Id
4V @ 250µA
Gate Charge (qg) @ Vgs
95nC @ 10V
Input Capacitance (ciss) @ Vds
1300pF @ 25V
Power - Max
136W
Mounting Type
Through Hole
Package / Case
TO-220-3 (Straight Leads)
Lead Free Status / RoHS Status
Contains lead / RoHS non-compliant
Other names
*IRF3315

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
IRF3315
Manufacturer:
IR
Quantity:
5 000
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IRF3315
Manufacturer:
IR
Quantity:
12 500
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IR
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Part Number:
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IR
Quantity:
12 500
Part Number:
IRF3315PBF
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Part Number:
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Part Number:
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Part Number:
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IR
Quantity:
10 000
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Part Number:
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Quantity:
15 872
Description
Fifth Generation HEXFETs from International Rectifier
utilize advanced processing techniques to achieve
extremely low on-resistance per silicon area. This
benefit, combined with the fast switching speed and
ruggedized device design that HEXFET Power
MOSFETs are well known for, provides the designer
with an extremely efficient and reliable device for use
in a wide variety of applications.
The TO-220 package is universally preferred for all
commercial-industrial applications at power
dissipation levels to approximately 50 watts. The low
thermal resistance and low package cost of the TO-
220 contribute to its wide acceptance throughout the
industry.
Absolute Maximum Ratings
Thermal Resistance
I
I
I
P
V
E
I
E
dv/dt
T
T
R
R
R
www.irf.com
D
D
AR
DM
GS
AS
STG
D
AR
J
@ T
@ T
JC
CS
JA
Advanced Process Technology
Dynamic dv/dt Rating
175°C Operating Temperature
Fast Switching
Fully Avalanche Rated
@T
C
C
C
= 25°C
= 100°C
= 25°C
Continuous Drain Current, V
Continuous Drain Current, V
Pulsed Drain Current
Power Dissipation
Linear Derating Factor
Gate-to-Source Voltage
Single Pulse Avalanche Energy
Avalanche Current
Repetitive Avalanche Energy
Peak Diode Recovery dv/dt
Operating Junction and
Storage Temperature Range
Soldering Temperature, for 10 seconds
Mounting torque, 6-32 or M3 srew
Junction-to-Case
Case-to-Sink, Flat, Greased Surface
Junction-to-Ambient
Parameter
Parameter
GS
GS
@ 10V
@ 10V
APPROVED
G
300 (1.6mm from case )
Typ.
0.50
–––
–––
HEXFET
10 lbf•in (1.1N•m)
-55 to + 175
D
S
Max.
TO-220AB
0.91
13.6
108
136
± 20
350
2.5
27
19
12
®
IRF3315
R
Power MOSFET
V
DS(on)
Max.
–––
1.1
62
DSS
I
D
= 27A
= 150V
PD -91623A
= 0.07
Units
Units
W/°C
°C/W
V/ns
mJ
mJ
°C
W
A
V
A
1
12/09/98

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IRF3315 Summary of contents

Page 1

... HEXFET TO-220AB Max. @ 10V GS @ 10V GS 108 136 0.91 ± 20 350 13.6 - 175 300 (1.6mm from case ) 10 lbf•in (1.1N•m) Typ. ––– 0.50 ––– PD -91623A IRF3315 ® Power MOSFET V = 150V DSS R = 0.07 DS(on 27A D Units W/° 2.5 V/ns ° ...

Page 2

... IRF3315 Electrical Characteristics @ T Parameter V Drain-to-Source Breakdown Voltage (BR)DSS Breakdown Voltage Temp. Coefficient (BR)DSS J R Static Drain-to-Source On-Resistance ––– DS(on) V Gate Threshold Voltage GS(th) g Forward Transconductance fs I Drain-to-Source Leakage Current DSS Gate-to-Source Forward Leakage I GSS Gate-to-Source Reverse Leakage Q Total Gate Charge ...

Page 3

... Fig 2. Typical Output Characteristics 3 2.5 2.0 ° 175 C J 1.5 1.0 0.5 = 50V 0.0 8.0 9.0 10.0 -60 -40 -20 0 Fig 4. Normalized On-Resistance IRF3315 VGS 15V 10V 8.0V 7.0V 6.0V INPUT NEW DATA 5.5V 5.0V 4.5V 4.5V 20µs PULSE WIDTH ° 175 ...

Page 4

... IRF3315 3000 1MHz iss rss gd 2500 oss iss 2000 1500 C oss 1000 C rss 500 Drain-to-Source Voltage (V) DS Fig 5. Typical Capacitance Vs. Drain-to-Source Voltage 100 175 C ° J INPUT NEW DATA 1 ° 0.1 0.3 0.6 0.9 V ,Source-to-Drain Voltage (V) SD Fig 7. Typical Source-Drain Diode ...

Page 5

... Fig 11. Maximum Effective Transient Thermal Impedance, Junction-to-Case www.irf.com APPROVED R G 10V Pulse Width Duty Factor Fig 10a. Switching Time Test Circuit V DS 90% 150 175 ° 10 d(on) Fig 10b. Switching Time Waveforms Notes: 1. Duty factor Peak 0.001 0. Rectangular Pulse Duration (sec) 1 IRF3315 D.U. µ d(off ...

Page 6

... IRF3315 Fig 12a. Unclamped Inductive Test Circuit Fig 12b. Unclamped Inductive Waveforms Charge Fig 13a. Basic Gate Charge Waveform 6 APPROVED 1000 800 600 400 + 200 Fig 12c. Maximum Avalanche Energy Same Type as D.U.T. 12V V GS Fig 13b. Gate Charge Test Circuit ...

Page 7

... Low Leakage Inductance Current Transformer - - + dv/dt controlled Driver same type as D.U.T. I controlled by Duty Factor "D" SD D.U.T. - Device Under Test P.W. Period D = Period Body Diode Forward Current di/dt Diode Recovery dv/dt Body Diode Forward Drop Ripple 5% Fig 14. For N-Channel HEXFETS IRF3315 + =10V ...

Page 8

... IRF3315 Package Outline TO-220AB Outline Dimensions are shown in millimeters (inches) 10 .54 (.4 15) 10 .29 (.4 05) 2.87 (.11 3) 2.62 (. 5.24 (. 4.84 (. 4.09 (. 3. 2.54 (. & ING 4. 82 LIN Part Marking Information TO-220AB ITH WORLD HEADQUARTERS: 233 Kansas St., El Segundo, California 90245, Tel: (310) 322 3331 EUROPEAN HEADQUARTERS: Hurst Green, Oxted, Surrey RH8 9BB, UK Tel 1883 732020 IR CANADA: 7321 Victoria Park Ave ...

Page 9

Note: For the most current drawings please refer to the IR website at: http://www.irf.com/package/ ...

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