PC817XI Sharp Microelectronics, PC817XI Datasheet
PC817XI
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PC817XI Summary of contents
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PC817X Series ∗ 4-channel package type is also available. (model No. PC847X Series) ■ Description PC817X Series contains an IRED optically coupled to a phototransistor packaged in a 4pin DIP, available in wide-lead spacing option and SMT gullwing ...
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... Epoxy resin 0.26 ±0.5 10.16 Anode 1 4 Cathode 2 Emitter 3 3 Collector 4 2. SMT Gullwing Lead-Form [ex. PC817XI] Anode mark 1 2 ±0.5 4.58 +0.4 1.0 −0 ±0.1 0.5 4. Wide SMT Gullwing Lead-Form [ex. PC817XFP] Rank mark Anode mark 1 2 ±0.5 4.58 ± ...
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Date code (2 digit) 1st digit Year of production A.D. Mark A.D Mark 1990 A 2002 P 1991 B 2003 R 1992 C 2004 S 1993 D 2005 T 1994 E 2006 U 1995 F 2007 V 1996 H 2008 ...
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Absolute Maximum Ratings Parameter Symbol Forward current Peak forward current I FM Reverse voltage V R Power dissipation P Collector-emitter voltage V CEO Emitter-collector voltage V ECO Collector current I C Collector power dissipation P C ...
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... PC817XP PC817XFP − PC817XI1 PC817XP1 − PC817XI2 PC817XP2 − PC817XI3 PC817XP3 − PC817XI4 PC817XP4 − PC817XI5 PC817XP5 − PC817XI6 PC817XP6 − PC817XI7 PC817XP7 − PC817XI8 PC817XP8 − PC817XI9 PC817XP9 − PC817XI0 PC817XP0 5 PC817X Series I [mA] C Rank mark =5mA, V =5V, T =25˚C) (I ...
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Fig.1 Forward Current vs. Ambient Temperature − Ambient temperature T Fig.3 Collector Power Dissipation vs. Ambient Temperature 250 200 150 100 50 0 − Ambient temperature T ...
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Fig.7 Forward Current vs. Forward Voltage 500 =75˚ 200 50˚C 100 0.5 1.0 1.5 2.0 Forward voltage V Fig.9 Relative Current Transfer Ratio vs. Ambient Temperature 150% =1mA ...
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Fig.13 Response Time vs. Load Resistance 500 = =2mA I 200 C =25˚ 100 0.5 0.2 0.1 0.01 0.1 1 Load resistance R Fig.15 Frequency Response ...
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Design Considerations ● Design guide While operating at I <1.0mA, CTR variation may increase. F Please make design considering this fact. This product is not designed against irradiation and incorporates non-coherent IRED. ● Degradation In general, the emission of ...
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Manufacturing Guidelines ● Soldering Method Reflow Soldering: Reflow soldering should follow the temperature profile shown below. Soldering should not exceed the curve of temperature profile and time. Please don't solder more than twice. (˚C) 300 Terminal : 260˚C peak ...
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Cleaning instructions Solvent cleaning: Solvent temperature should be 45˚C or below Immersion time should be 3minutes or less Ultrasonic cleaning: The impact on the device varies depending on the size of the cleaning bath, ultrasonic output, cleaning time, size ...
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Package specification ● Sleeve package 1. Through-Hole or SMT Gullwing Lead-Form Package materials Sleeve : HIPS (with anti-static material) Stopper : Styrene-Elastomer Package method MAX. 100pcs of products shall be packaged in a sleeve. Both ends shall be closed ...
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Tape and Reel package 1. SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions F Dimensions List A ±0.3 16.0 7.5 H ±0.1 10.4 0.4 ...
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Wide SMT Gullwing Package materials Carrier tape : PS Cover tape : PET (three layer system) Reel : PS Carrier tape structure and Dimensions Dimensions List A ±0.3 24.0 11.5 H ±0.1 12.4 0.4 Reel structure and Dimensions e ...
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Important Notices · The circuit application examples in this publication are provided to explain representative applications of SHARP devices and are not intended to guarantee any circuit design or license any intellectual property rights. SHARP takes no responsibility for ...