ESDA14V2-4BF3 STMicroelectronics, ESDA14V2-4BF3 Datasheet
ESDA14V2-4BF3
Specifications of ESDA14V2-4BF3
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ESDA14V2-4BF3 Summary of contents
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... Figure 1. Pin layout (bump side) Figure 2. Configuration A1 Description The ESDA14V2-4BF3 is a monolithic array designed to protect lines bidirectionally against ESD transients. The device is ideal for situations where board space saving is required. This device is particularly adapted to the protection of symmetrical signals. Doc ID 11645 Rev 4 ...
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... Leakage current @ V RM Stand-off voltage Clamping voltage Dynamic impedance Peak pulse current Capacitance min. max. max µA 0 2.5 µs. p -25 ° (25 °C) BR Doc ID 11645 Rev 4 ESDA14V2-4BF3 Value ± 25 ± 15 ± 125 -55 to +150 260 -40 to +125 Slope (1) (2) typ. max. ...
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... ESDA14V2-4BF3 Figure 3. Clamping voltage versus peak pulse current (T (rectangular waveform, t 10.0 t =2.5 µ initial =25 °C j 1.0 0 Figure 5. Relative variation of leakage current versus junction temperature (typical values) 100 Figure 7. ESD response to IEC 61000-4-2 (-15 kV air discharge) Figure 4. initial = 25 ° 2.5 µ (V) CL ...
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... Ls Rs MODEL = D01 4 MODEL = D01 MODEL = D01 MODEL = D01 MODEL = D02 Rs Lgnd B2 Doc ID 11645 Rev 4 ESDA14V2-4BF3 aplacvar Ls 290pH aplacvar Lgnd 130pH aplacvar Rs 100m Model D01 Model D02 BV=16 BV=16 IBV=1m IBV=1m CJO=12p CJO=320p M=0.333 M=0.333 RS=2.9 RS=80m VJ=0.6 VJ=0.6 TT=100n TT=100n ...
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... ESDA14V2-4BF3 3 Ordering information scheme Figure 11. Ordering information scheme ESD array Breakdown voltage 14V2 = 14.2 Volts min. Number of line lines Type B = Bidirectional Package F = Flip Chip lead-free, pitch = 400µm, bump height = 255 µm 4 Package information In order to meet environmental requirements, ST offers these devices in different grades of ® ...
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... AN1751: EMI Filters: Recommendations and measurements 6/8 Figure 14. Marking Dot xx = marking z = manufacturing location yww = datecode (y = year ww = week) ECOPACK grade Dot identifying Pin A1 location 4.0 ± 0.1 1.04 User direction of unreeling Doc ID 11645 Rev 4 ESDA14V2-4BF3 Ø 1.5 ± 0.1 4.0 ± 0.1 ...
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... ESDA14V2-4BF3 5 Ordering information Table 3. Ordering information Order code ESDA14V2-4BF3 6 Revision history Table 4. Document revision history Date Revision 19-Sep-2005 15-Dec-2005 18-Apr-2008 28-Jan-2010 Marking Package EF Flip Chip 1 Initial release. Dimension from center bump to corner bump changed in Figure indicate diagonal instead of perpendicular measurement. No values changed ...
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... Australia - Belgium - Brazil - Canada - China - Czech Republic - Finland - France - Germany - Hong Kong - India - Israel - Italy - Japan - Malaysia - Malta - Morocco - Philippines - Singapore - Spain - Sweden - Switzerland - United Kingdom - United States of America 8/8 Please Read Carefully: © 2010 STMicroelectronics - All rights reserved STMicroelectronics group of companies www.st.com Doc ID 11645 Rev 4 ESDA14V2-4BF3 ...