ESD9R3.3ST5G ON Semiconductor, ESD9R3.3ST5G Datasheet - Page 4

TVS ESD ULT LOW CAP SOD-923

ESD9R3.3ST5G

Manufacturer Part Number
ESD9R3.3ST5G
Description
TVS ESD ULT LOW CAP SOD-923
Manufacturer
ON Semiconductor
Datasheet

Specifications of ESD9R3.3ST5G

Voltage - Reverse Standoff (typ)
3.3V
Voltage - Breakdown
4.8V
Power (watts)
150mW
Polarization
Unidirectional
Mounting Type
Surface Mount
Package / Case
SOD-923
Polarity
Unidirectional
Clamping Voltage
7.8 V
Operating Voltage
3.3 V
Breakdown Voltage
4.8 V
Termination Style
SMD/SMT
Peak Surge Current
1 A
Capacitance
0.5 pF
Maximum Operating Temperature
+ 125 C
Minimum Operating Temperature
- 55 C
Dimensions
0.6 mm W x 0.8 mm L
Reverse Stand-off Voltage Vrwm
3.3V
Clamping Voltage Vc Max
7.8V
Diode Configuration
Unidirectional
Peak Pulse Current Ippm
1A
Diode Case Style
SOD-923
No. Of Pins
2
Power Dissipation Pd
150mW
Rohs Compliant
Yes
Lead Free Status / RoHS Status
Lead free / RoHS Compliant

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to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability
arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages.
“Typical” parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All
operating parameters, including “Typicals” must be validated for each customer application by customer’s technical experts. SCILLC does not convey any license under its patent rights
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c
b
1
are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice
2X
0.08 (0.0032) X Y
H
D
E
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
−X−
2
E
−Y−
L
A
0.90
N. American Technical Support: 800−282−9855 Toll Free
Europe, Middle East and Africa Technical Support:
Japan Customer Focus Center
PACKAGE DIMENSIONS
SOLDERING FOOTPRINT*
USA/Canada
Phone: 421 33 790 2910
Phone: 81−3−5773−3850
http://onsemi.com
0.30
CASE 514AB−01
SOD−923
ISSUE B
DIMENSIONS: MILLIMETERS
4
0.40
NOTES:
1. DIMENSIONING AND TOLERANCING PER ANSI
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD
Y14.5M, 1982.
FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS OF
BASE MATERIAL.
DIM
H
A
b
c
D
E
L
E
MIN
0.34
0.15
0.07
0.75
0.55
0.95
0.05
MILLIMETERS
NOM
0.37
0.20
0.12
0.80
0.60
1.00
0.10
ON Semiconductor Website: www.onsemi.com
Order Literature: http://www.onsemi.com/orderlit
For additional information, please contact your local
Sales Representative
MAX
0.40
0.25
0.17
0.85
0.65
1.05
0.15
0.013
0.006
0.003
0.030
0.022
0.037
0.002
MIN
INCHES
NOM
0.015
0.008
0.005
0.031
0.024
0.039
0.004
MAX
0.016
0.010
0.007
0.033
0.026
0.041
0.006
ESD9R3.3S/D

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