PIC18F6310-I/PT Microchip Technology, PIC18F6310-I/PT Datasheet - Page 214

IC PIC MCU FLASH 4KX16 64TQFP

PIC18F6310-I/PT

Manufacturer Part Number
PIC18F6310-I/PT
Description
IC PIC MCU FLASH 4KX16 64TQFP
Manufacturer
Microchip Technology
Series
PIC® 18Fr

Specifications of PIC18F6310-I/PT

Program Memory Type
FLASH
Program Memory Size
8KB (4K x 16)
Package / Case
64-TFQFP
Core Processor
PIC
Core Size
8-Bit
Speed
40MHz
Connectivity
I²C, SPI, UART/USART
Peripherals
Brown-out Detect/Reset, HLVD, POR, PWM, WDT
Number Of I /o
54
Ram Size
768 x 8
Voltage - Supply (vcc/vdd)
4.2 V ~ 5.5 V
Data Converters
A/D 12x10b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
PIC18F
Core
PIC
Data Bus Width
8 bit
Data Ram Size
768 B
Interface Type
SPI/I2C/EUSART/AUSART
Maximum Clock Frequency
40 MHz
Number Of Programmable I/os
54
Number Of Timers
4
Operating Supply Voltage
4.2 V to 5.5 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52715-96, 52716-328, 52717-734, 52712-325, EWPIC18
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE2000, ICE4000, DV164136, DM183032
Minimum Operating Temperature
- 40 C
On-chip Adc
12-ch x 10-bit
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPDV007003 - PROGRAMMER UNIVERSAL PROMATE II
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
PIC18F6310-I/PT
Manufacturer:
Microchip Technology
Quantity:
10 000
PIC18F6310/6410/8310/8410
17.4.17.2
During a Repeated Start condition, a bus collision
occurs if:
a)
b)
When the user deasserts SDA and the pin is allowed to
float high, the BRG is loaded with SSPADD<6:0> and
counts down to ‘0’. The SCL pin is then deasserted and
when sampled high, the SDA pin is sampled.
FIGURE 17-29:
FIGURE 17-30:
DS39635C-page 214
A low level is sampled on SDA when SCL goes
from low level to high level.
SCL goes low before SDA is asserted low,
indicating that another master is attempting to
transmit a data ‘1’.
SDA
SCL
BCLIF
RSEN
S
SSPIF
SDA
SCL
RSEN
BCLIF
S
SSPIF
Bus Collision During a Repeated
Start Condition
BUS COLLISION DURING A REPEATED START CONDITION (CASE 1)
BUS COLLISION DURING A REPEATED START CONDITION (CASE 2)
SCL goes low before SDA,
set BCLIF. Release SDA and SCL.
T
BRG
Sample SDA when SCL goes high.
If SDA = 0, set BCLIF and release SDA and SCL.
masters can assert SDA at exactly the same time.
If SDA is low, a bus collision has occurred (i.e., another
master is attempting to transmit a data ‘0’,
If SDA is sampled high, the BRG is reloaded and begins
counting. If SDA goes from high-to-low before the BRG
times out, no bus collision occurs because no two
If SCL goes from high-to-low before the BRG times out
and SDA has not already been asserted, a bus collision
occurs. In this case, another master is attempting to
transmit a data ‘1’ during the Repeated Start condition
(see
If, at the end of the BRG time-out, both SCL and SDA
are still high, the SDA pin is driven low and the BRG is
reloaded and begins counting. At the end of the count,
regardless of the status of the SCL pin, the SCL pin is
driven low and the Repeated Start condition is
complete.
Figure
17-30).
T
Cleared in software
 2010 Microchip Technology Inc.
BRG
Interrupt cleared
in software
‘0’
‘0’
‘0’
Figure
17-29).

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