DSPIC33FJ64GS606-I/MR Microchip Technology, DSPIC33FJ64GS606-I/MR Datasheet - Page 373

• Manufacturer Part Number: DSPIC33FJ64GS606-I/MR
• Description: IC MCU/DSP 64KB FLASH 64QFN
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ64GS606-I/MR

• Program Memory Type: FLASH
• Program Memory Size: 64KB (64K x 8)
• Package / Case: 64-VFQFN, Exposed Pad
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART, USB
• Peripherals: Brown-out Detect/Reset, DMA, QEI, POR, PWM, WDT
• Number Of I /o: 58
• Ram Size: 9K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 16x10b; D/A 1x10b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Numeric And Arithmetic Format: Fixed-Point or Floating-Point
• Instruction Set Architecture: Harvard
• Device Million Instructions Per Second: 40 MIPs
• Maximum Clock Frequency: 120 MHz
• Number Of Programmable I/os: 58
• Data Ram Size: 4 KB
• Operating Supply Voltage: 3.3 V
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Interface Type: I2C, SPI, UART
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 16 Channel
• On-chip Dac: 10 bit, 4 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

FIGURE 27-11:
TABLE 27-30: SPIx MASTER MODE (CKE = 0) TIMING REQUIREMENTS
 2010 Microchip Technology Inc.
AC CHARACTERISTICS
SP10
SP11
SP20
SP21
SP30
SP31
SP35
SP40
SP41
Note 1:
Param
dsPIC33FJ32GS406/606/608/610 and dsPIC33FJ64GS406/606/608/610
No.
Note: Refer to Figure 27-1 for load conditions.
(CKP = 0)
(CKP = 1)
SDIx
SCKx
SCKx
SDOx
2:
3:
4:
TscL
TscH
TscF
TscR
TdoF
TdoR
TscH2doV,
TscL2doV
TdiV2scH,
TdiV2scL
TscH2diL,
TscL2diL
Symbol
These parameters are characterized but not tested in manufacturing.
Data in “Typ” column is at 3.3V, +25°C unless otherwise stated.
The minimum clock period for SCKx is 100 ns. Therefore, the clock generated in Master mode must not
violate this specification.
Assumes 50 pF load on all SPIx pins.
SPIx MODULE MASTER MODE (CKE = 0) TIMING CHARACTERISTICS
SCKx Output Low Time
SCKx Output High Time
SCKx Output Fall Time
SCKx Output Rise Time
SDOx Data Output Fall Time
SDOx Data Output Rise Time
SDOx Data Output Valid after
SCKx Edge
Setup Time of SDIx Data Input
to SCKx Edge
Hold Time of SDIx Data Input
to SCKx Edge
Characteristic
SP35
SP31
SP11
SP40 SP41
MSb In
MSb
SP10
(1)
Preliminary
Bit 14 - - - -1
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Bit 14 - - - - - -1
T
T
Min
CY
CY
23
30
—
—
—
—
—
/2
/2
SP21
SP20
Typ
—
—
—
—
—
—
—
—
6
(2)
SP30
SP20
SP21
Max
LSb In
—
—
—
—
—
—
20
—
—
LSb
-40°C  T
-40°C  T
Units
ns
ns
ns
ns
ns
ns
ns
ns
ns
A
A
 +85°C for Industrial
 +125°C for Extended
See Note 3
See Note 3
See parameter D032
and Note 4
See parameter D031
and Note 4
See parameter D032
and Note 4
See parameter D031
and Note 4
DS70591C-page 373
Conditions