DSPIC33FJ128MC804-I/PT Microchip Technology, DSPIC33FJ128MC804-I/PT Datasheet - Page 376

• Manufacturer Part Number: DSPIC33FJ128MC804-I/PT
• Description: IC DSPIC MCU/DSP 128K 44TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 33Fr

Specifications of DSPIC33FJ128MC804-I/PT

• Program Memory Type: FLASH
• Program Memory Size: 128KB (128K x 8)
• Package / Case: 44-TQFP, 44-VQFP
• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 40 MIPs
• Connectivity: CAN, I²C, IrDA, LIN, SPI, UART/USART
• Peripherals: Brown-out Detect/Reset, DMA, Motor Control PWM, QEI, POR, PWM, WDT
• Number Of I /o: 35
• Ram Size: 16K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 9x10b/12b, D/A 6x16b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Product: DSCs
• Data Bus Width: 16 bit
• Processor Series: DSPIC33F
• Core: dsPIC
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 35
• Data Ram Size: 16 KB
• Maximum Operating Temperature: + 85 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120, DM240001, DV164033
• Minimum Operating Temperature: - 40 C
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DV164033 - KIT START EXPLORER 16 MPLAB ICD2DM240001 - BOARD DEMO PIC24/DSPIC33/PIC32
• Eeprom Size: -
• Lead Free Status / Rohs Status: Lead free / RoHS Compliant

dsPIC33FJ32GP302/304, dsPIC33FJ64GPX02/X04, AND dsPIC33FJ128GPX02/X04
31.1
TABLE 31-1:
TABLE 31-2:
TABLE 31-3:
TABLE 31-4:
DS70292E-page 376
High Temperature Devices
Power Dissipation:
Internal chip power dissipation:
I/O Pin Power Dissipation:
Maximum Allowed Power Dissipation
DC CHARACTERISTICS
Operating Voltage
HDC10
DC CHARACTERISTICS
Power-Down Current (I
HDC60e
HDC61c
Note 1:
Parameter
Parameter
Characteristic
No.
No.
2:
3:
4:
Operating Junction Temperature Range
I/O = Σ ({V
High Temperature DC Characteristics
P
Operating Ambient Temperature Range
INT
Base I
pulled to V
The Δ current is the additional current consumed when the module is enabled. This current should be
added to the base I
These currents are measured on the device containing the most memory in this family.
These parameters are characterized, but are not tested in manufacturing.
Supply Voltage
V
= V
Symbol
DD
DD
OPERATING MIPS VS. VOLTAGE
THERMAL OPERATING CONDITIONS
DC TEMPERATURE AND VOLTAGE SPECIFICATIONS
DC CHARACTERISTICS: POWER-DOWN CURRENT (I
PD
Typical
DD
250
x (I
is measured with all peripherals and clocks shut down. All I/Os are configured as inputs and
3
SS
- V
DD
. WDT, etc., are all switched off, and VREGS (RCON<8>) = 1.
PD
OH
- Σ I
)
} x I
Characteristic
Rating
OH
PD
3.0V to 3.6V
V
OH
2000
(in Volts)
Max
DD
)
current.
5
—
) + Σ (V
Range
OL
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
Units
x I
μA
μA
OL
Standard Operating Conditions: 3.0V to 3.6V
(unless otherwise stated)
Operating temperature
)
Min
3.0
Temperature Range
+150°C
+150°C
-40°C to +150°C
Typ
3.3
(in °C)
-40°C ≤ T
Symbol
P
DMAX
Max
3.3V
3.3V
P
T
T
3.6
A
D
J
-40°C ≤ T
A
≤ +150°C for High Temperature
Units
Conditions
Min
Base Power-Down Current
Watchdog Timer Current: ΔI
-40
-40
PD
V
A
dsPIC33FJ64GPX02/X04, and
≤ +150°C for High Temperature
)
dsPIC33FJ128GPX02/X04
dsPIC33FJ32GP302/304,
(T
P
© 2011 Microchip Technology Inc.
INT
J
-40°C to +150°C
- T
Typ
—
—
+ P
A
)/θ
Max MIPS
I
/
JA
O
Conditions
20
+155
+150
Max
(1,3)
WDT (2,4)
Unit
°C
°C
W
W