DSPIC30F6012A-30I/PT Microchip Technology, DSPIC30F6012A-30I/PT Datasheet - Page 4

IC DSPIC MCU/DSP 144K 64TQFP

DSPIC30F6012A-30I/PT

Manufacturer Part Number
DSPIC30F6012A-30I/PT
Description
IC DSPIC MCU/DSP 144K 64TQFP
Manufacturer
Microchip Technology
Series
dsPIC™ 30Fr

Specifications of DSPIC30F6012A-30I/PT

Program Memory Type
FLASH
Program Memory Size
144KB (48K x 24)
Package / Case
64-TFQFP
Core Processor
dsPIC
Core Size
16-Bit
Speed
30 MIPs
Connectivity
CAN, I²C, SPI, UART/USART
Peripherals
AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
Number Of I /o
52
Eeprom Size
4K x 8
Ram Size
8K x 8
Voltage - Supply (vcc/vdd)
2.5 V ~ 5.5 V
Data Converters
A/D 16x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Product
DSCs
Data Bus Width
16 bit
Processor Series
DSPIC30F
Core
dsPIC
Maximum Clock Frequency
30 MHz
Number Of Programmable I/os
52
Data Ram Size
8 KB
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
52713-733, 52714-737, 53276-922, EWDSPIC
Development Tools By Supplier
PG164130, DV164035, DV244005, DV164005, PG164120, ICE4000, DM240002, DM330011
Minimum Operating Temperature
- 40 C
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
XLT64PT5 - SOCKET TRAN ICE 64MQFP/TQFPAC164319 - MODULE SKT MPLAB PM3 64TQFPAC30F008 - MODULE SKT FOR DSPIC30F 64TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
DSPIC30F6012A30IP

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
DSPIC30F6012A-30I/PT
Manufacturer:
Microchip Technology
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10 000
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Manufacturer:
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dsPIC30F6011A/6012A/6013A/6014A
Silicon Errata Issues
1. Module: CPU
EXAMPLE 1:
DS80457B-page 4
L0:daw.b
L1: ....
Note:
The Decimal Adjust instruction, DAW.b, may
improperly clear the Carry bit, C (SR<0>), when
executed.
Work around
Check the state of the Carry bit prior to executing
the DAW.b instruction. If the Carry bit is set, set the
Carry bit again after executing the DAW.b
instruction. Example 1 shows how the application
should process the Carry bit during a BCD addition
operation.
Affected Silicon Revisions
.include “p30fxxxx.inc”
.......
mov.b
mov.b
add.b
bra
daw.b
bset.b
bra
A2
X
This document summarizes all silicon
errata issues from all revisions of silicon,
previous as well as current. Only the
issues indicated by the shaded column in
the following tables apply to the current
silicon revision (B1).
B0
X
#0x80, w0
#0x80, w1
w0, w1, w2 ;Perform addition
NC, L0
w2
L1
w2
SR, #C
B1
X
CHECK CARRY BIT BEFORE
DAW.b
;First BCD number
;Second BCD number
;If C set go to L0
;If not,do DAW and
;set the carry bit
;and exit
2. Module: Output Compare
If the desired duty cycle is ‘0’ (OCxRS = 0), the
module will generate a high level glitch of 1 T
Additionally, on the next cycle after the glitch, the
OC pin does not go high, or, in other words, it
misses the next compare for any value written on
OCxRS.
Work around
There are two possible solutions to this problem:
1. Load a value greater than ‘0’ to the OCxRS
2. If the application requires 0% duty cycles, the
Affected Silicon Revisions
A2
X
register when operating in PWM mode. In this
case, no 0% duty cycle is achievable.
output compare module can be disabled for
0% duty cycles, and re-enabled for non-zero
percent duty cycles.
B0
X
B1
X
© 2010 Microchip Technology Inc.
CY
.

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