DSPIC30F6014-30I/PF Microchip Technology, DSPIC30F6014-30I/PF Datasheet - Page 24

• Manufacturer Part Number: DSPIC30F6014-30I/PF
• Description: IC DSPIC MCU/DSP 144K 80TQFP
• Manufacturer: Microchip Technology
• Series: dsPIC™ 30Fr

Specifications of DSPIC30F6014-30I/PF

• Core Processor: dsPIC
• Core Size: 16-Bit
• Speed: 30 MIPs
• Connectivity: CAN, I²C, SPI, UART/USART
• Peripherals: AC'97, Brown-out Detect/Reset, I²S, LVD, POR, PWM, WDT
• Number Of I /o: 68
• Program Memory Size: 144KB (48K x 24)
• Program Memory Type: FLASH
• Eeprom Size: 4K x 8
• Ram Size: 8K x 8
• Voltage - Supply (vcc/vdd): 2.5 V ~ 5.5 V
• Data Converters: A/D 16x12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 80-TQFP, 80-VQFP
• Core Frequency: 40MHz
• Core Supply Voltage: 5.5V
• Embedded Interface Type: CAN, I2C, SPI, UART
• No. Of I/o's: 68
• Flash Memory Size: 144KB
• Supply Voltage Range: 2.5V To 5.5V
• Package: 80TQFP
• Device Core: dsPIC
• Family Name: dsPIC30
• Maximum Speed: 30 MHz
• Operating Supply Voltage: 3.3|5 V
• Data Bus Width: 16 Bit
• Number Of Programmable I/os: 68
• Interface Type: 3-Wire/AC97/CAN/I2C/I2S/SPI/UART
• On-chip Adc: 16-chx12-bit
• Number Of Timers: 5
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: DM300024 - KIT DEMO DSPICDEM 1.1DM300004-2 - BOARD DEMO DSPICDEM.NET 2DM300004-1 - BOARD DEMO DSPICDEM.NET 1AC164314 - MODULE SKT FOR PM3 80PFAC30F001 - MODULE SOCKET DSPIC30F 80TQFPXLT80PT2 - SOCKET TRANSITION ICE 80TQFPDV164005 - KIT ICD2 SIMPLE SUIT W/USB CABLE
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant, Lead free / RoHS Compliant
• Other names: DSPIC30F601430IPF

dsPIC30F6011/6012/6013/6014
41. Module: CPU
1.
2.
EXAMPLE 20:
42. Module: ADC
DS80456D-page 24
The device exhibits I
Work around
If the application does not use the on-chip A/D
converter, it is possible to reduce the I
below 0.1 μA. The following additional measures
need to be taken in these circumstances:
In the application hardware, the V
(pin 24) on the dsPIC30F601X device should be
connected to the circuit ground (GND).
In the application software, the code sequence
shown in Example 20 should be executed to
bring the device into the power-saving Sleep
mode.
Affected Silicon Revisions
If the ADC module is in an enabled state when the
device enters Sleep mode as a result of executing
a PWRSAV #0 instruction, the device power-down
current (I
in the device data sheet. This may happen even if
the ADC module is disabled by clearing the ADON
bit prior to entering Sleep mode.
Work around
In order to remain within the I
listed in the device data sheet, the user software
must completely disable the ADC module by
setting the ADC Module Disable bit in the
corresponding Peripheral Module Disable register
(PMDx), prior to executing a PWRSAV
instruction.
Affected Silicon Revisions
.include “p30f6014.inc”
.......
BCLR
MOV
MOV
BCLR
PWRSAV #SLEEP_MODE
A3
A3
X
X
B1
B1
X
PD
ADCON1, #ADON
#0x2000, W0
W0, ADCON2
PMD1, #ADCMD
) may exceed the specifications listed
B2
B2
X
PD
of approximately 100 μA.
;Required code
;sequence for
;low power-down
;current.
;Device enters
;SLEEP mode here
PD
REF
specifications
+/RA10 pin
PD
to values
#0
© 2010 Microchip Technology Inc.