C8051F412-GQ Silicon Laboratories Inc, C8051F412-GQ Datasheet - Page 135

IC 8051 MCU 16K FLASH 32LQFP

C8051F412-GQ

Manufacturer Part Number
C8051F412-GQ
Description
IC 8051 MCU 16K FLASH 32LQFP
Manufacturer
Silicon Laboratories Inc
Series
C8051F41xr
Datasheets

Specifications of C8051F412-GQ

Program Memory Type
FLASH
Program Memory Size
16KB (16K x 8)
Package / Case
32-LQFP
Core Processor
8051
Core Size
8-Bit
Speed
50MHz
Connectivity
SMBus (2-Wire/I²C), SPI, UART/USART
Peripherals
Brown-out Detect/Reset, POR, PWM, Temp Sensor, WDT
Number Of I /o
24
Ram Size
2.25K x 8
Voltage - Supply (vcc/vdd)
2 V ~ 5.25 V
Data Converters
A/D 20x12b; D/A 2x12b
Oscillator Type
Internal
Operating Temperature
-40°C ~ 85°C
Processor Series
C8051F4x
Core
8051
Data Bus Width
8 bit
Data Ram Size
2.25 KB
Interface Type
I2C/SMBus/SPI/UART
Maximum Clock Frequency
50 MHz
Number Of Programmable I/os
24
Number Of Timers
4
Operating Supply Voltage
2 V to 5.25 V
Maximum Operating Temperature
+ 85 C
Mounting Style
SMD/SMT
3rd Party Development Tools
PK51, CA51, A51, ULINK2
Development Tools By Supplier
C8051F410DK
Minimum Operating Temperature
- 40 C
On-chip Dac
2-ch x 12-bit
No. Of I/o's
24
Ram Memory Size
2368Byte
Cpu Speed
50MHz
No. Of Timers
4
Rohs Compliant
Yes
Package
32LQFP
Device Core
8051
Family Name
C8051F41x
Maximum Speed
50 MHz
Lead Free Status / RoHS Status
Lead free / RoHS Compliant
For Use With
770-1006 - ISP 4PORT FOR SILABS C8051F MCU336-1453 - ADAPTER PROGRAM TOOLSTICK F410336-1317 - KIT EVAL FOR C8051F411336-1314 - KIT DEV FOR C8051F41X
Eeprom Size
-
Lead Free Status / Rohs Status
Lead free / RoHS Compliant
Other names
336-1310

Available stocks

Company
Part Number
Manufacturer
Quantity
Price
Part Number:
C8051F412-GQ
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
Part Number:
C8051F412-GQR
Manufacturer:
Silicon Laboratories Inc
Quantity:
10 000
16. Flash Memory
On-chip, re-programmable Flash memory is included for program code and non-volatile data storage. The
Flash memory can be programmed in-system through the C2 interface or by software using the MOVX
write instruction. Once cleared to logic 0, a Flash bit must be erased to set it back to logic 1. Flash bytes
would typically be erased (set to 0xFF) before being reprogrammed. The write and erase operations are
automatically timed by hardware for proper execution; data polling to determine the end of the write/erase
operations is not required. Code execution is stalled during Flash write/erase operations. Refer to
Table 16.2 for complete Flash memory electrical characteristics.
16.1. Programming The Flash Memory
The simplest means of programming the Flash memory is through the C2 interface using programming
tools provided by Silicon Laboratories or a third party vendor. This is the only means for programming a
non-initialized device. For details on the C2 commands to program Flash memory, see
Interface” on page 265
Section “16.4. Flash Write and Erase Guidelines” on page 139
To ensure the integrity of the Flash contents, the on-chip VDD Monitor must be enabled to the
higher setting (VDMLVL = '1') in any system that includes code that writes and/or erases Flash
memory from software. Furthermore, there should be no delay between enabling the V
and enabling the V
the V
16.1.1. Flash Lock and Key Functions
Flash writes and erases by user software are protected with a lock and key function. The Flash Lock and
Key Register (FLKEY) must be written with the correct key codes, in sequence, before Flash operations
may be performed. The key codes are: 0xA5, 0xF1. The timing does not matter, but the codes must be
written in order. If the key codes are written out of order, or the wrong codes are written, Flash writes and
erases will be disabled until the next system reset. Flash writes and erases will also be disabled if a Flash
write or erase is attempted before the key codes have been written properly. The Flash lock resets after
each write or erase; the key codes must be written again before a following Flash operation can be per-
formed. The FLKEY register is detailed in SFR Definition 16.2.
16.1.2. Flash Erase Procedure
The Flash memory can be programmed by software using the MOVX write instruction with the address and
data byte to be programmed provided as normal operands. Before writing to Flash memory using MOVX,
Flash write operations must be enabled by: (1) setting the PSWE Program Store Write Enable bit
(PSCTL.0) to logic 1 (this directs the MOVX writes to target Flash memory); and (2) Writing the Flash key
codes in sequence to the Flash Lock register (FLKEY). The PSWE bit remains set until cleared by software.
A write to Flash memory can clear bits to logic 0 but cannot set them; only an erase operation can set bits
to logic 1 in Flash. A byte location to be programmed should be erased before a new value is written.
The Flash memory is organized in 512-byte pages. The erase operation applies to an entire page (setting
all bytes in the page to 0xFF). To erase an entire 512-byte page, perform the following steps:
DD
Step 1. Disable interrupts (recommended).
Step 2. Write the first key code to FLKEY: 0xA5.
Step 3. Write the second key code to FLKEY: 0xF1.
Step 4. Set the PSEE bit (register PSCTL).
Step 5. Set the PSWE bit (register PSCTL).
Step 6. Using the MOVX instruction, write a data byte to any location within the 512-byte page to
Step 7. Clear the PSWE and PSEE bits.
Step 8. Re-enable interrupts.
Monitor disabled will cause a Flash Error device reset.
be erased.
DD
Monitor as a reset source. Any attempt to write or erase Flash memory while
. For detailed guidelines on writing or erasing Flash from firmware, please see
Rev. 1.1
.
C8051F410/1/2/3
Section “26. C2
DD
Monitor
135

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