PIC24HJ12GP202-I/ML Microchip Technology, PIC24HJ12GP202-I/ML Datasheet - Page 13

• Manufacturer Part Number: PIC24HJ12GP202-I/ML
• Description: IC PIC MCU FLASH 4KX24 28QFN
• Manufacturer: Microchip Technology
• Series: PIC® 24Hr

Specifications of PIC24HJ12GP202-I/ML

• Core Size: 16-Bit
• Program Memory Size: 12KB (4K x 24)
• Peripherals: Brown-out Detect/Reset, POR, PWM, WDT
• Core Processor: PIC
• Speed: 40 MIPs
• Connectivity: I²C, SPI, UART/USART
• Number Of I /o: 21
• Program Memory Type: FLASH
• Ram Size: 1K x 8
• Voltage - Supply (vcc/vdd): 3 V ~ 3.6 V
• Data Converters: A/D 10x10b/12b
• Oscillator Type: Internal
• Operating Temperature: -40°C ~ 85°C
• Package / Case: 28-VQFN Exposed Pad, 28-HVQFN, 28-SQFN, 28-DHVQFN
• Controller Family/series: PIC24
• No. Of I/o's: 21
• Ram Memory Size: 1KB
• Cpu Speed: 40MIPS
• No. Of Timers: 4
• Processor Series: PIC24HJ
• Core: PIC
• Data Bus Width: 16 bit
• Data Ram Size: 1024 B
• Interface Type: I2C, SPI, UART
• Maximum Clock Frequency: 40 MHz
• Number Of Programmable I/os: 21
• Number Of Timers: 3
• Maximum Operating Temperature: + 125 C
• Mounting Style: SMD/SMT
• 3rd Party Development Tools: 52713-733, 52714-737, 53276-922, EWDSPIC
• Development Tools By Supplier: PG164130, DV164035, DV244005, DV164005, PG164120
• Minimum Operating Temperature: - 40 C
• On-chip Adc: 10 bit, 10 Channel / 12 bit, 10 Channel
• Lead Free Status / RoHS Status: Lead free / RoHS Compliant
• For Use With: AC164336 - MODULE SOCKET FOR PM3 28/44QFNDV164033 - KIT START EXPLORER 16 MPLAB ICD2
• Eeprom Size: -
• Lead Free Status / Rohs Status: Details

2.0
2.1
Getting started with the PIC24HJ12GP201/202 family
of 16-bit microcontrollers requires attention to a
minimal set of device pin connections before
proceeding with development. The following is a list of
pin names, which must always be connected:
• All V
• All AV
• V
• MCLR pin
• PGECx/PGEDx pins used for In-Circuit Serial
• OSC1 and OSC2 pins when external oscillator
Additionally, the following pins may be required:
• V
© 2009 Microchip Technology Inc.
Note:
(see Section 2.2 “Decoupling Capacitors”)
used)
(see Section 2.2 “Decoupling Capacitors”)
(see Section 2.3 “Capacitor on Internal Voltage
Regulator (Vcap/Vddcore)”)
(see Section 2.4 “Master Clear (MCLR) Pin”)
Programming™ (ICSP™) and debugging purposes
(see Section 2.5 “ICSP Pins”)
source is used
(see Section 2.6 “External Oscillator Pins”)
reference for ADC module is implemented
Note:
CAP
REF
DD
+/V
/V
DD
GUIDELINES FOR GETTING
STARTED WITH 16-BIT
MICROCONTROLLERS
Basic Connection Requirements
DDCORE
and V
REF
and AV
This data sheet summarizes the features
of the PIC24HJ12GP201/202 family of
devices. It is not intended to be a
comprehensive
complement the information in this data
sheet, refer to the “PIC24H Family
Reference Manual”, which is available
from
(www.microchip.com).
The AV
connected independent of the ADC
voltage reference source.
- pins used when external voltage
SS
SS
pins
the
DD
pins (even if ADC module is not
and AV
Microchip
reference
SS
pins must be
source.
web
site
Preliminary
To
2.2
The use of decoupling capacitors on every pair of
power supply pins, such as V
AV
Consider the following criteria when using decoupling
capacitors:
• Value and type of capacitor: Recommendation
• Placement on the printed circuit board: The
• Handling high frequency noise: If the board is
• Maximizing performance: On the board layout
of 0.1 µF (100 nF), 10-20V. This capacitor should
be a low-ESR and have a resonance frequency in
the range of 20 MHz and higher. It is
recommended that ceramic capacitors be used.
decoupling capacitors should be placed as close
to the pins as possible. It is recommended to
place the capacitors on the same side of the
board as the microcontroller. If space is con-
stricted, the capacitor can be placed on another
layer on the PCB using a via; however, ensure
that the trace length from the pin to the capacitor
is within one-quarter inch (6 mm) in length.
experiencing high frequency noise, upward of
tens of MHz, add a second ceramic-type capacitor
in parallel to the above described decoupling
capacitor. The value of the second capacitor can
be in the range of 0.01 µF to 0.001 µF. Place this
second capacitor next to the primary decoupling
capacitor. In high-speed circuit designs, consider
implementing a decade pair of capacitances as
close to the power and ground pins as possible.
For example, 0.1 µF in parallel with 0.001 µF.
from the power supply circuit, run the power and
return traces to the decoupling capacitors first,
and then to the microcontroller pins. This ensures
that the decoupling capacitors are first in the
power chain. Equally important is to keep the
trace length between the capacitor and the power
pins to a minimum thereby reducing PCB track
inductance.
SS
is required.
Decoupling Capacitors
DD
, V
DS70282D-page 11
SS
, AV
DD
, and